New methodology for modelling MOL TDDB coping with variability
New methodology for modelling MOL TDDB coping with variability
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MOL TDDB 建模应对可变性的新方法
DOI：
10.1109/irps.2018.8353555
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发表时间：
2018
期刊：
影响因子：
--
通讯作者：
A. Mocuta
中科院分区：
文献类型：
--
作者：
P. Roussel;A. Chasin;S. Demuynck;N. Horiguchi;D. Linten;A. Mocuta
我们报道了一种新的时间相关介质击穿(TDDB)寿命模型，该模型考虑了各种变化源的影响。我们证明了通常分别用于FEOL和BEOL TDDB寿命预测的标准威布尔分布和对数正态分布不适用于MOL TDDB分析。由于可变性的来源很多，只有不同的可变性分离技术的组合--在某些情况下，甚至包括威布尔分布和对数正态分布的卷积作为最后手段--才能调和内在故障机制和额外的可变性。该方法能够正确地拟合和预测集成低k间隔层介质的可靠性。
We report a novel time-dependent dielectric breakdown (TDDB) lifetime model which accounts for the impact of various sources of variability. We prove that the standard Weibull and Lognormal distributions normally used for FEOL and BEOL TDDB lifetime predictions respectively are not adequate for MOL TDDB analysis. Due to the many sources of variability, only a combination of different variability separation techniques — even including a convolution of a Weibull and Lognormal distribution as a last resort for some cases — can reconcile the intrinsic breakdown mechanism with the extra variability. This approach is shown to correctly fit and predict the reliability of integrated low-k spacer dielectrics.