Micromachined jets for liquid impingement cooling of VLSI chips
Micromachined jets for liquid impingement cooling of VLSI chips
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DOI：
10.1109/jmems.2004.835768
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发表时间：
2004-10-01
影响因子：
2.7
通讯作者：
Kenny, TW
中科院分区：
文献类型：
--
作者：
Wang, EN;Zhang, L;Kenny, TW
两相微射流冲击冷却是高功率VLSI芯片散热的潜在解决方案。微射流阵列有望实现更均匀的芯片温度和非常高的传热系数。本文介绍了圆孔直径为40 ~ 76 μ m的单射流和多射流阵列的设计和制造，以及集成加热器和温度传感器测试装置。利用集成的加热装置和工业标准的1cm(2)热测试芯片对微射流散热器的性能进行了研究。对于单相，硅温度分布数据与考虑硅传导和流体平流的模型一致，对流系数范围为0.072 ~ 4.4 W/cm(2)K。对于两相，实验结果表明，在1厘米(2)的加热区域上，使用具有76个孔径的四射流阵列，在8毫升/分钟的流量下，温度上升100度，热量去除高达90瓦。数据表明对流系数与池沸腾系数没有显著差异，这激励了未来优化流量和流型的工作。这些微射流散热器的目的是最终集成到闭环电渗透泵冷却系统。
Two-phase microjet impingement cooling is a potential solution for removing heat from high-power VLSI chips. Arrays of microjets promise to achieve more uniform chip temperatures and very high heat transfer coefficients. This paper presents the design and fabrication of single-jets and multijet arrays with circular orifice diameters ranging from 40 to 76 mum, as well as integrated heater and temperature sensor test devices. The performance of the microjet heat sinks is studied using the integrated heater device as well as an industry standard 1 cm(2) thermal test chip. For single-phase, the silicon temperature distribution data are consistent with a model accounting for silicon conduction and fluid advection using convection coefficients in the range from 0.072 to 4.4 W/cm(2)K. For two-phase, the experimental results show a heat removal of up to 90 W on a 1 cm(2) heated area using a four-jet array with 76 mum diameter orifices at a flowrate of 8 ml/min with a temperature rise of 100 degreesC. The data indicate convection coefficients are not significantly different from coefficients for pool boiling, which motivates future work on optimizing flowrates and flow regimes. These microjet heat sinks are intended for eventual integration into a closed-loop electroosmotically pumped cooling system.