BULK AND INTERFACE STRESSES IN SILVER-NICKEL MULTILAYERED THIN-FILMS
BULK AND INTERFACE STRESSES IN SILVER-NICKEL MULTILAYERED THIN-FILMS
复制标题
DOI：
10.1063/1.354692
复制
发表时间：
1993-08-15
影响因子：
3.2
通讯作者：
SPAEPEN, F
中科院分区：
文献类型：
--
作者：
RUUD, JA;WITVROUW, A;SPAEPEN, F
用X射线衍射法从衬底曲率和晶格参数测量了[111]织构的Ag/Ni多层膜的应力。多层膜的总应力与层沉积应力之间的差异可归因于-2.27+/-0.67J/m2的界面拉伸应力。由极低的相互溶解度表明，在该体系中不太可能形成界面相。
Stresses were measured in [111]-textured Ag/Ni multilayered thin films from the substrate curvature and from lattice parameter measurements by x-ray diffraction. The difference between the total multilayer film stress and the layer deposition stresses can be attributed to a tensile interface stress of -2.27 +/- 0.67 J/m2. Interfacial phase formation is unlikely in this system as indicated by the exceptionally low mutual solubilities.