Simple non-galvanic flip-chip integration method for hybrid quantum systems
Simple non-galvanic flip-chip integration method for hybrid quantum systems
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DOI：
10.1063/1.5089888
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发表时间：
2019-04
影响因子：
4
通讯作者：
K. Satzinger;C. Conner;A. Bienfait;H.-S. Chang;M. Chou;A. Cleland;É. Dumur;J. Grebel;G. Peairs;R. Povey;S. Whiteley;Y. Zhong;D. Awschalom;D. Schuster;A. Cleland
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文献类型：
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作者：
K. Satzinger;C. Conner;A. Bienfait;H.-S. Chang;M. Chou;A. Cleland;É. Dumur;J. Grebel;G. Peairs;R. Povey;S. Whiteley;Y. Zhong;D. Awschalom;D. Schuster;A. Cleland
探索混合量子系统的实验者所面临的挑战是如何以量子相干的方式集成和互连不同的材料和不同的衬底。在这里，我们提出了一种简单而廉价的倒装芯片键合工艺，适用于在不同衬底的芯片上集成混合量子器件。该工艺只需要常规用于接触光刻的设备和材料，并且可以解除键合并重新使用芯片。该技术需要最小的压缩力，因此它与各种不同的基材兼容。与铟基键合不同，该过程不会在两个芯片之间建立电流连接，但正如我们所展示的，在某些情况下，这是不必要的。我们演示了技术，使用光刻图案化的四分之一波长共面波导谐振器，在一个芯片上制造，并将这些电感耦合到一个单独的芯片上光刻图案化的传输线。这两个芯片的垂直间距约为7 μm，我们可以重复实现优于2 μm的横向对准。我们测量了低功率（101光子）内质量因子Qi约为5 × 105的电磁共振，与单芯片性能相当，设计耦合质量因子Qc范围为2 × 102 ~ 5 × 105。如何以量子相干的方式集成和互连不同材料和不同衬底是探索混合量子系统的实验者面临的挑战。在这里，我们提出了一种简单而廉价的倒装芯片键合工艺，适用于在不同衬底的芯片上集成混合量子器件。该工艺只需要常规用于接触光刻的设备和材料，并且可以解除键合并重新使用芯片。该技术需要最小的压缩力，因此它与各种不同的基材兼容。与铟基键合不同，该过程不会在两个芯片之间建立电流连接，但正如我们所展示的，在某些情况下，这是不必要的。我们演示了技术，使用光刻图案化的四分之一波长共面波导谐振器，在一个芯片上制造，并将这些电感耦合到一个单独的芯片上光刻图案化的传输线。这两个芯片有一个垂直...
A challenge faced by experimenters exploring hybrid quantum systems is how to integrate and interconnect different materials and different substrates in a quantum-coherent fashion. Here, we present a simple and inexpensive flip-chip bonding process, suitable for integrating hybrid quantum devices on chips from different substrates. The process only requires equipment and materials used routinely for contact photolithography, and it is possible to undo the bonding and reuse the chips. The technique requires minimal compressive force, so it is compatible with a wide range of different substrates. Unlike indium-based bonding, this process does not establish a galvanic connection between the two chips, but as we show, in some situations this is not necessary. We demonstrate the technique using lithographically patterned quarter-wave coplanar waveguide resonators, fabricated on one chip, and couple these inductively to a transmission line patterned lithographically on a separate chip. The two chips have a vertical interchip gap of about 7 μm, and we can repeatedly achieve lateral alignments of better than 2 μm. We measure electromagnetic resonances with low-power (∼1 photon) internal quality factors Qi around 5 × 105, comparable to single-chip performances, with as-designed coupling quality factors Qc ranging from 2 × 102 to 5 × 105.A challenge faced by experimenters exploring hybrid quantum systems is how to integrate and interconnect different materials and different substrates in a quantum-coherent fashion. Here, we present a simple and inexpensive flip-chip bonding process, suitable for integrating hybrid quantum devices on chips from different substrates. The process only requires equipment and materials used routinely for contact photolithography, and it is possible to undo the bonding and reuse the chips. The technique requires minimal compressive force, so it is compatible with a wide range of different substrates. Unlike indium-based bonding, this process does not establish a galvanic connection between the two chips, but as we show, in some situations this is not necessary. We demonstrate the technique using lithographically patterned quarter-wave coplanar waveguide resonators, fabricated on one chip, and couple these inductively to a transmission line patterned lithographically on a separate chip. The two chips have a vert...