Spray angle effect during spray cooling of microelectronics: Experimental measurements and comparison with inverse calculations
Spray angle effect during spray cooling of microelectronics: Experimental measurements and comparison with inverse calculations
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DOI：
10.1016/j.applthermaleng.2006.01.023
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发表时间：
2006-11-01
影响因子：
6.4
通讯作者：
Ramaprian, B.
中科院分区：
文献类型：
--
作者：
Li, B. Q.;Cader, T.;Ramaprian, B.
对微电子产品的喷雾冷却进行了实验和反计算研究，重点研究了喷雾角度对冷却性能的影响。热测试芯片提供加热的目标，并由单个压力旋流雾化器冷却。热读数是在0-60度的喷雾角度下获得的，距离加热的芯片表面有1.4厘米的固定距离。提出了一种利用测量的模具内部温度数据计算未知喷雾冷却热流的逆传热算法。计算方案采用有限元方法和截断单值分解相结合的方法，并利用偏差原理确定最优截断阈值。实验测量结果与计算结果吻合较好。对于这个特殊的系统，使用两个邻接点的温度读数直接估计热通量将产生不正确的热通量结果，如果要从测量中获得准确的热通量，逆算法被认为是必不可少的。研究发现，在较大的喷雾角度下，喷雾体积流量的减少是造成喷雾脱落的一个主要原因。(C)2006爱思唯尔有限公司。保留所有权利。
An experimental and inverse computational study is presented of spray cooling of microelectronics with an emphasis on the spray angle effects on cooling performance. A thermal test chip provides the heated target, and is cooled by a single pressure swirl atomizer. Thermal readings were taken at the spray angles of 0-60 degrees, at a fixed distance of 1.4 cm from the heated die surface. An inverse heat transfer computational algorithm is developed to calculate the unknown spray cooling heat fluxes using the measured temperature data inside the die. The computational scheme is a combination of the finite element method and the truncated single value decomposition with the discrepancy principle for determining the optimal truncation threshold value. Good agreement is obtained between the experimental measurements and calculated results. For this particular system, a direct estimate using temperature readings at two adjacent points would produce incorrect heat flux results and an inverse algorithm is deemed essential if an accurate heat flux is to be obtained from the measurements. It is found that a major cause for the drop-off is the reduction in spray volumetric flux delivered to the die at the greater spray angles. (c) 2006 Elsevier Ltd. All rights reserved.