Solventless polyimide films by vapor deposition
Solventless polyimide films by vapor deposition
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气相沉积无溶剂聚酰亚胺薄膜
DOI：
10.1116/1.573930
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发表时间：
1986
期刊：
影响因子：
--
通讯作者：
R. Yang
中科院分区：
文献类型：
--
作者：
J. Salem;F. Sequeda;J. Duran;Wen;R. Yang
采用气相沉积聚合（VDP）技术，在一种新型的薄膜蒸发器上制备了聚酰胺/亚胺薄膜。该工艺利用二酐和二胺前体的共蒸发。源渗出率的控制允许薄膜化学计量控制在1mol %以上。红外、电子能谱分析（ESCA）和热重分析（TGA）的结果与制备的VDP薄膜是聚酰亚胺固化的聚酰亚胺的解释一致。低角光散射（LALS）技术测定的聚酰亚胺的重量平均分子量为13000，与断裂点伸长率的测量值一致。举离试验表明，气相沉积的聚酰亚胺比自旋涂覆的杜邦RC5878更能抵抗硅界面上的水解侵蚀。介电常数（e=2.91）和耗散系数（tan δ=0.008）均低于常规材料。
Vapor deposition polymerization (VDP) has been employed for the preparation of polyamic acid/imide films using a conventional thin film evaporator with a novel source design. The process utilizes the coevaporation of the dianhydride and diamine precursors. Control of source effusion rates permit film stoichiometry to be held to better than 1 mol %. Infrared, electron spectroscopy for chemical analysis (ESCA), and thermogravimetric analysis (TGA) results are consistent with the interpretation that the VDP films produced are polyamic acid curable to polyimide. The weight average molecular weight of the polyimide as determined by low angle light scattering (LALS) technique is 13 000, in agreement with the value estimated from the measured percent elongation at break point. Lift‐off tests showed that vapor deposited polyimide is more resistant to hydrolitic attack at the silicon interface than spin coated Dupont RC5878. Dielectric constant (e=2.91) and dissipation factor (tan δ=0.008) are lower than those rep...