Thermally conductive composite film filled with highly dispersed graphene nanoplatelets via solvent-free one-step fabrication
Thermally conductive composite film filled with highly dispersed graphene nanoplatelets via solvent-free one-step fabrication
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DOI：
10.1016/j.compositesb.2016.11.014
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发表时间：
2017-02-01
影响因子：
13.1
通讯作者：
Kim, Seong Yun
中科院分区：
文献类型：
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作者：
Yu, Jaesang;Cha, Ji Eun;Kim, Seong Yun
我们提出了一种无溶剂熔融工艺来制备高电导率聚合物复合膜，填充了高分散的GNP填料。利用X射线微CT(Micro-CT)观察到GNP填料在复合膜中的良好分散性，这是一种有助于精确分析复合膜内部结构的非破坏性三维(3D)分析技术。实验测得的复合膜的电导率和热导率与Mod-Tanaka方法的理论计算值很好地吻合，这也证实了GNP填料的良好分散性。当GNP含量为20wt%时，复合薄膜的电导率为10(1)S/m数量级，面内热导率为7.1W/m.K。(C)2016爱思唯尔有限公司。保留所有权利。
We proposed a solvent-free melting process for fabricating high-conductivity polymer composite films filled with highly dispersed GNP fillers. The excellent dispersion of GNP fillers in the composite films was observed using X-ray micro-computed tomography (micro-CT), a non-destructive three-dimensional (3D) analysis technique that helps to analyze the internal structures of composite films with precision. The excellent dispersion of GNP fillers also confirmed by the fact that experimentally determined electrical and thermal conductivity values of the composite films were well consistent with the theoretical calculations obtained with a Mod-Tanaka method. The composite films exhibited an electrical conductivity on the order of 10(1) S/m and the in-plane thermal conductivity of 7.1 W/m.K when they contained 20 wt% GNP fillers. (C) 2016 Elsevier Ltd. All rights reserved.