Electrodeposited Superconducting Re on Flexible Substrates Using Aerosol Jet Printed Metal Seed Layers
Electrodeposited Superconducting Re on Flexible Substrates Using Aerosol Jet Printed Metal Seed Layers
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DOI：
10.1109/tasc.2023.3311320
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发表时间：
2023-11
影响因子：
1.8
通讯作者：
K. Ahammed;L. Tsui;Shianne Carroll;Judi Lavin;Q. Huang
中科院分区：
文献类型：
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作者：
K. Ahammed;L. Tsui;Shianne Carroll;Judi Lavin;Q. Huang
研究了在柔性衬底上的气溶胶喷射印刷（AJP）金属种子层上电沉积超导Re。使用“Nanojet”气溶胶喷射打印机在Kapton膜上打印银和金种子层。进行热重分析、触针轮廓仪和三点弯曲测试来表征这种柔性衬底上的AJP金属种子层。成功地进行了电沉积的Re上的Au种子层，其特征在于使用各种技术，如X射线荧光光谱，聚焦离子束，扫描电子显微镜，能量色散谱，X射线衍射，和四点探针在低温下的电气测量。这种柔性Re堆的超导电性被证实具有6K的升高的临界温度（Tc）。
Electrodeposition of superconducting Re on aerosol jet printed (AJP) metal seed layers on a flexible substrate is investigated. Silver and gold seed layers are printed using the “Nanojet” aerosol jet printer on Kapton films. Thermogravimetric analysis, stylus profilometer, and three-point bend test are performed to characterize the AJP metal seed layer on such flexible substrates. Electrodeposition of Re is successfully carried out on the Au seed layer and is characterized using various techniques, such as X-ray fluorescence spectroscopy, focused ion beam, scanning electron microscope, energy dispersive spectroscopy, X-ray diffraction, and four-point probe electrical measurements at cryogenic temperatures. The superconductivity of such a flexible Re stack is confirmed with an elevated critical temperature (Tc) of 6 K.