Signal Integrity Improvements of a MEMS Probe Card Using Back-Drilling and Equalizing Techniques
Signal Integrity Improvements of a MEMS Probe Card Using Back-Drilling and Equalizing Techniques
复制标题
使用背钻和均衡技术改善 MEMS 探针卡的信号完整性
DOI：
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发表时间：
2011
影响因子：
5.6
通讯作者：
Hai
中科院分区：
文献类型：
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作者：
Dong;J. Byun;Sang;Se;K. Kang;Hai
本文描述了目前用于测试在300 MHz下工作的存储器件的探针卡的电气性能。已经发现探针卡的大印刷电路板组件消耗了总信号传输损耗的70%。我们提出了一个同时应用的回钻和均衡技术，大大提高了信号的完整性（SI）的插入损耗的减少和平坦化的频率响应，分别。这些技术非常简单，易于通过钻孔设备的数控和表面安装技术来实现。经过均衡和回钻后，Δ 3 dB带宽从传统探针卡的0.66 GHz提高到2.46 GHz。我们还实现了53%的过渡时间（Tr/Tf）的减少和51%的峰峰值抖动的改善。我们期望同时应用回钻和均衡可以有效地用于进一步提高当前晶圆级探针卡的性能。
This paper characterizes the electrical performance of a probe card that is currently used for the test of memory devices operating at 300 MHz. The large printed circuit board assembly of the probe card has been found to consume 70% of the total signal transmission loss. We propose a simultaneous application of the back-drilling and the equalization techniques that greatly improve the signal integrity (SI) by reduction of the insertion loss and by planarization of the frequency response, respectively. These techniques are very simple and easy to be implemented by the numerical control of the drilling equipment and the surface mount technology. The Δ 3-dB bandwidth has greatly been improved from 0.66 GHz of the conventional probe card to 2.46 GHz after both of the equalization and the back-drilling. We also achieved 53% reductions of the transition times (Tr/Tf) and 51% improvement of the peak-to-peak jitter. We expect the simultaneous application of the back-drilling and the equalization be effectively used for further improvements of current wafer-level probe card performance.