Review of Fiber-Based Three-Dimensional Printing for Applications Ranging from Nanoscale Nanoparticle Alignment to Macroscale Patterning
Review of Fiber-Based Three-Dimensional Printing for Applications Ranging from Nanoscale Nanoparticle Alignment to Macroscale Patterning
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DOI：
10.1021/acsanm.1c01408
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发表时间：
2021-08
影响因子：
5.9
通讯作者：
Weiheng Xu;Yuxiang Zhu;Dharneedar Ravichandran;Sayli Jambhulkar;Mounika Kakarla;Mohammed Bawareth
中科院分区：
文献类型：
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作者：
Weiheng Xu;Yuxiang Zhu;Dharneedar Ravichandran;Sayli Jambhulkar;Mounika Kakarla;Mohammed Bawareth
增材制造 (AM) 领域在过去 4 年来取得了惊人的增长，因为其革命性的加工机制将自下而上和自上而下的方法相结合。许多人猜测它将作为第四次工业革命挑战传统制造方法。在三维 (3D) 打印的子领域中，基于挤出的直接墨水书写 (DIW) 以其广泛的材料选择、高设计灵活性和可接受的成本效率而闻名，可打印许多急需的材料系统，例如水凝胶或气凝胶、纳米颗粒悬浮液、复合混合物、液晶和液态金属。此外，DIW 构建复杂架构或层次结构的能力也有助于在不同领域实现更广泛的应用，包括智能机器人、能源生成和存储设备、生物医学植入物和可持续系统。本综述全面总结了 DIW 开发的最新进展，重点关注不同尺度的工程图案，即纳米颗粒排列、一维 (1D) 纤维微观结构操纵和宏观二维 (2D)/3D 空间图案。它强调了从纳米级粒子取向到宏观级长程有序结构的层次结构。最后，讨论了阻碍 DIW 更广泛应用或阻碍基础研究工业商业化的技术障碍和重大挑战。
The field of additive manufacturing (AM) has witnessed spectacular growth in the past 4 decades because of its revolutionary processing mechanism in combining bottom-up and top-down approaches. Many have speculated that it will challenge traditional fabrication methods as the fourth industrial revolution. Among the subfields of three-dimensional (3D) printing, extrusion-based direct ink writing (DIW) is known for its vast material choices, high design flexibility, and acceptable cost efficiency to print many urgently demanded material systems, such as hydrogels or aerogels, nanoparticle suspensions, composite mixtures, liquid crystals, and liquid metals. Furthermore, the DIW’s ability to construct complex architectures or hierarchies also contributes to broader applications across different fields, including intelligent robotics, energy generation and storage devices, biomedical implants, and sustainability systems. This review provides a comprehensive summary of recent advances in DIW development, focusing on engineered patterns at different scales, namely, nanoparticle alignment, one-dimensional (1D) fiber microstructure manipulation, and macroscale two-dimensional (2D)/3D spatial patterning. It highlights the hierarchies from nanoscale particle orientations to macroscale long-range-ordered structures. Finally, technical barriers and significant challenges prohibiting DIW for broader applications or impeding fundamental research to industrial commercialization are discussed.