Solderability of Bulk Metallic Glasses Using Lead-Free Solders
Solderability of Bulk Metallic Glasses Using Lead-Free Solders
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DOI：
10.2320/matertrans.me200824
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发表时间：
2009-06
影响因子：
1.2
通讯作者：
H. Nishikawa;Krit WongPiromsarn;H. Abe;T. Takemoto;M. Fukuhara;A. Inoue
中科院分区：
文献类型：
--
作者：
H. Nishikawa;Krit WongPiromsarn;H. Abe;T. Takemoto;M. Fukuhara;A. Inoue
进行了一项可行性研究，以确定是否可以采用焊接和引线键合等低温连接工艺将大块金属玻璃(BMG)连接到BMG上，将BMG连接到晶体金属上。因此，为了评价BMG的可焊性，本研究基本对三种BMG进行了焊料铺展试验。结果表明，在503K和523K温度下，Pd基BMG对焊料具有良好的润湿行为，而对于铜基和锆基BMG，无论峰值温度如何，焊料在BMG表面都没有润湿。然后对超声波焊接工艺进行了试验，建立了宝马的连接工艺。可见，超声波在焊接过程中的应用是有效的。
A feasibility study has been conducted to determine whether the low temperature joining process such as soldering process and wire bonding process can be applied to join a bulk metallic glass (BMG) to a BMG and a BMG to a crystalline metal. Therefore, in order to evaluate the solderability of BMGs, the spread test of the solder was basically performed for three kind of BMGs in this study. As a result, Pd-based BMG exhibited a good wetting behavior of the solder at 503 K and 523 K. On the other hand, concerning Cu-based and Zr-based BMGs, there was no wetting of the solder on the surface of BMGs regardless of the peak temperature. Then the ultrasonic soldering process was tested to establish the joint process for BMGs. It was clear that the application of ultrasonic is effective to the soldering process.