Basic Investigations on Joining of Metal and Fibre Components Based on the Semi-Solid Forming Process
Basic Investigations on Joining of Metal and Fibre Components Based on the Semi-Solid Forming Process
复制标题
基于半固态成型工艺的金属和纤维部件连接的基础研究
DOI:
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发表时间:
2015
期刊:
影响因子:
--
通讯作者:
K. Riedmüller
中科院分区:
文献类型:
--
作者:
L. Marx;M. Liewald;K. Riedmüller
The trend towards lightweight construction in automotive engineering causes additional effort and higher expense in vehicle manufacturing, because new materials or, respectively, new material combinations require adapted production and processing methods. Various combinations of metallic and fibre-based structures (GRP-/ CFRP components) presuppose convenient joining methods. In this context, an innovative joining method for combining sheet metals with carbon textiles is going to be developed at the Institute for Metal Forming Technology (IFU, University of Stuttgart / Germany). The goal of this research work is motivated by the prevention of any damage of the used textile fibre structures during the joining process (compared to mechanical joining methods like screwing or riveting). Based on the semi-solid forming technology, the new joining process is going to be developed to create a material integrated interlock between fibres and metallic components.This paper deals with the first fundamental investigations, conducted at IFU, which have already shown the technical feasibility of this new type of joining technique. The research work to be carried out comprises the usage of different sheet alloys: the combinations steel-aluminium, aluminium-aluminium and steel-steel are to be joined with layers of carbon fibre fabrics. By this innovative joining method, a firmly bonded and non-aging connection between textile and metallic materials is to be produced, without the need of any adhesive materials or associated preparative cleaning methods.
DOI:
10.14416/j.ijast.2014.07.003
发表时间:
2014-07
期刊:
King Mongkut’s University of Technology North Bangkok International Journal of Applied Science and Technology
影响因子:
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作者:
M. Liewald;K. Riedmüller
通讯作者:
M. Liewald;K. Riedmüller
DOI:
10.4028/www.scientific.net/ssp.192-193.89
发表时间:
2012
期刊:
Solid State Phenomena
影响因子:
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作者:
Riedmüller;K. R. ;Liewald;Kertesz
通讯作者:
Kertesz