Study of gluing and wire bonding for the Belle II Silicon Vertex Detector
Study of gluing and wire bonding for the Belle II Silicon Vertex Detector
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Belle II 硅顶点探测器的粘合和引线键合研究
DOI：
10.1016/j.nima.2014.06.053
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发表时间：
2014
期刊：
影响因子：
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通讯作者：
K.H.Kang et al.
中科院分区：
文献类型：
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作者：
金山 雅人;大原謙一;高橋弘毅;平沼 悠太;Jordan B. Camp;Alexander Stroeer;幸村孝由;Nobuaki Imai;H. Sugiyama;K.H.Kang et al.
本文介绍了日本 KEK 的 Belle II 实验中组装硅顶点探测器 (SVD) 的胶合和引线键合研究。优化硅微带传感器、支撑框架和读出柔性电缆的粘合对于实现所需的机械精度非常重要。传感器和读出电子芯片之间的引线键合也需要特别小心，以最大限度地发挥 SVD 的物理性能。硅传感器和信号扇出柔性电路（节距适配器）通过引线接合进行粘合和连接。我们确定粘合质量对于实现良好的粘合效率非常重要。测得最佳结果的胶水厚度标准偏差为 3.11 μm。引线键合的最佳机器参数确定为：间距适配器为 70 mW 功率、20 gf 力和 20 ms；硅带传感器为 60 mW 功率、20 gf 力和 20 ms；这些参数提供（10.92±0.72）gf 的拉力。通过这些设置，75% 的节距适配器和 25% 的条带传感器会出现颈断式断裂。
This paper describes an investigation into gluing and wire bonding for assembling the Silicon Vertex Detector (SVD) for the Belle II experiment at KEK in Japan. Optimizing the gluing of the silicon microstrip sensors, the support frame, and the readout flex cables is important for achieving the required mechanical precision. The wire bonding between the sensors and the readout electronic chips also needs special care to maximize the physics capability of the SVD. The silicon sensors and signal fan out flex circuits (pitch adapters) are glued and connected using wire bonding. We determine that gluing quality is important for achieving good bonding efficiency. The standard deviation in the glue thickness for the best result is measured to be 3.11 μm. Optimal machine parameters for wire bonding are determined to be 70 mW power, 20 gf force, and 20 ms for the pitch adapter and 60 mW power, 20 gf force, and 20 ms for the silicon strip sensors; these parameters provide a pull force of (10.92±0.72) gf. With these settings, 75% of the pitch adapters and 25% of the strip sensors experience theneck-brokentype of break.