The heat conduction model and leakage characterization of the sealing interface
The heat conduction model and leakage characterization of the sealing interface
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DOI：
10.1016/j.ijthermalsci.2019.106027
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发表时间：
2019-11
影响因子：
4.5
通讯作者：
Shen Wang;Xue-Rong Yao;Huazhong Yang
中科院分区：
文献类型：
--
作者：
Shen Wang;Xue-Rong Yao;Huazhong Yang
本文提出了一种新的密封界面泄漏表征方法，利用温度场和温度梯度场来检测泄漏位置和测量泄漏率。首先，分别基于二维和三维热传导模型，从理论上建立了泄漏率的计算公式。其次，建立了一般泄漏区和集中泄漏区的有限元模型，其中采用热传导模型计算的泄漏率与模拟的泄漏率吻合较好。最后，利用橡胶-铝合金密封界面的密封盒进行了界面泄漏实验，验证了该新表征原理在确定泄漏率和泄漏位置方面的有效性。结果表明，基于红外热像技术获得的温度场和温度梯度场的密封界面泄漏表征方法是可行的。
In this paper, a new leakage characterization method for the sealing interface is proposed to detect the leakage location and measure the leakage rate based on the temperature field and the temperature gradient field. First, the formulas of the leakage rate are theoretically established based on the two-dimensional and the three-dimensional heat conduction model, respectively. Second, the finite element models of the general leakage area and the concentrated leakage area are built, in which the leakage rate calculated by means of heat conduction model fits the simulated leakage rate well. Finally, the interface leakage experiment is conducted using a sealed box with a rubber-aluminum alloy sealing interface, which validates the effectiveness of this new characterization principle for determining the leakage rate and the leakage location. The results indicate that the feasibility of the leakage characterization method for the sealing interface based on the temperature field and the temperature gradient field obtained from the infrared thermography technique.