DPU-Bench: A Micro-Benchmark Suite to Measure Offload Efficiency Of SmartNICs
DPU-Bench: A Micro-Benchmark Suite to Measure Offload Efficiency Of SmartNICs
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DPU-Bench:用于测量 SmartNIC 卸载效率的微基准套件
DOI:
10.1145/3569951.3593595
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发表时间:
2023
期刊:
影响因子:
--
通讯作者:
Poole, Steve
中科院分区:
文献类型:
--
作者:
Michalowicz, Benjamin;Kandadi Suresh, Kaushik;Subramoni, Hari;Panda, Dhabaleswar;Poole, Steve
Smart Network Interface Cards (SmartNIC) have experienced massive growth in popularity over the last few years such as the NVIDIA BlueField-2 Data Processing Unit (DPU). Being equipped with their own set of cores and memory allows them to perform actions beyond a regular NIC, and HPC researchers are designing new ways to use them. For example, offloading communication to one enables the CPU "host" to perform more computationally heavy tasks. However, one question remains: How much of that work can be distributed among processes placed on the SmartNIC before facing performance degradation? We present DPU-Bench: A low-level micro-benchmark suite using IB-Verbs primitives to enable HPC users to examine the number of processes to be placed on one or more SmartNICs in order to efficiently offload a given communication pattern. We examine direct algorithms in this paper at a medium scale with different work assignment mechanisms and give insights into the trends found with varying numbers of worker processes and message sizes.
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DOI:
10.1007/978-3-030-78713-4_2
发表时间:
2021
期刊:
--
影响因子:
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作者:
Mohammadreza Bayatpour;Nick Sarkauskas;H. Subramoni;J. Hashmi;D. Panda
通讯作者:
Mohammadreza Bayatpour;Nick Sarkauskas;H. Subramoni;J. Hashmi;D. Panda
DOI:
10.1145/3437359.3465582
发表时间:
2021
期刊:
Practice and Experience in Advanced Research Computing
影响因子:
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作者:
Pouya Kousha;Kamal Raj Sankarapandian Dayala Ganesh Ram;M. Kedia;H. Subramoni;Arpan Jain;A. Shafi;D. Panda;Trey Dockendorf;Heechang Na;K. Tomko
通讯作者:
K. Tomko
DOI:
10.1109/hipc53243.2021.00054
发表时间:
2021
期刊:
and Analytics (HiPC
影响因子:
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作者:
Sarkauskas, Nick;Bayatpour, Mohammadreza;Tran, Tu;Ramesh, Bharath;Subramoni, Hari;Panda, Dhabaleswar K.
通讯作者:
Panda, Dhabaleswar K.
DOI:
10.1109/hoti52880.2021.00017
发表时间:
2021
期刊:
2021 IEEE Symposium on High-Performance Interconnects (HOTI
影响因子:
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作者:
Jain, Arpan;Alnaasan, Nawras;Shafi, Aamir;Subramoni, Hari;Panda, Dhabaleswar K
通讯作者:
Panda, Dhabaleswar K
DOI:
10.1109/hcs52781.2021.9567066
发表时间:
2021
期刊:
2021 IEEE Hot Chips 33 Symposium (HCS)
影响因子:
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作者:
Idan Burstein
通讯作者:
Idan Burstein