Patterning of CIGS thin films induced by rear-side laser ablation of polyimide carrier foil
Patterning of CIGS thin films induced by rear-side laser ablation of polyimide carrier foil
复制标题
聚酰亚胺载体箔背面激光烧蚀诱导 CIGS 薄膜图案化
DOI：
10.1007/s00339-013-7962-2
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发表时间：
2013
期刊：
影响因子：
--
通讯作者：
K. Zimmer
中科院分区：
文献类型：
--
作者：
M. Ehrhardt;A. Wehrmann;P. Lorenz;K. Zimmer
薄膜的激光图案化对于柔性电子器件的未来发展至关重要。通过集成互连制造太阳能模块所需的热敏薄膜（诸如铜-铟-镓二硒化物（CIGS））的无损伤划片仍然具有挑战性。在这项研究中，提出了一种新的方法，非热，无损伤的聚酰亚胺箔上的CIGS薄膜划线。与通常使用的薄膜叠层的直接激光烧蚀相反，在高于3 J/cm 2的激光能量密度下的聚酰亚胺载体箔的激光烧蚀被用于实现CIGS膜分层并因此实现薄膜的图案化。图案化的CIGS膜的边缘不显示典型的激光烧蚀诱导的修改，如熔化，碎片污染，或裂纹形成。薄膜去除的机制是非热起源，可能是由于在CIGS/Mo界面处的应力形成，所述应力形成来自聚酰亚胺激光烧蚀的二次过程，如冲击波形成或局部样品变形。
Laser patterning of thin films is essential for the future development of flexible electronic devices. The damage-free scribing of thermally sensitive thin films such as copper–indium–gallium diselenide (CIGS) that is required for solar module fabrication by integrated interconnections is still challenging. In this study a new approach for non-thermal, damage-free scribing of CIGS films on polyimide foil is proposed and demonstrated. In contrast to the usually used direct laser ablation of the thin-film stack, laser ablation of the polyimide carrier foil at laser fluences higher than 3 J/cm2 is utilized to achieve CIGS film delamination and thus the patterning of the thin film. The edges of the patterned CIGS films do not show typical laser-ablation-induced modifications like melting, debris contamination, or crack formation. The mechanism of the thin-film removal is of non-thermal origin and is probably due to stress formation at the CIGS/Mo interface resulting from secondary processes of polyimide laser ablation like shock-wave formation or local sample deformation.