Analysis on the Influence of Oxidant in CMP of Ultra-Thin Stainless Steel
Analysis on the Influence of Oxidant in CMP of Ultra-Thin Stainless Steel
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DOI：
10.4028/www.scientific.net/amr.1027.167
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发表时间：
2014-10
期刊：
影响因子：
--
通讯作者：
J. Su;Jia Peng Chen;Haifeng Cheng;S. Fan
中科院分区：
文献类型：
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作者：
J. Su;Jia Peng Chen;Haifeng Cheng;S. Fan
在超薄不锈钢化学机械抛光（CMP）中，抛光液中的氧化剂决定了材料去除率（MRR）。研究了氧化铝磨料化学机械抛光超薄304不锈钢时，抛光液中氧化剂对抛光速率和表面粗糙度的影响。研究结果表明，在相同条件下，MRR随氧化剂C和氧化剂B的增加而增大，随氧化剂A的增加而减小，氧化剂C的MRR最大。结果表明，氧化剂C对304不锈钢化学机械抛光的残留率有较大影响。研究结果可为超薄不锈钢CMP抛光液的研究提供参考。
In chemical mechanical polishing (CMP) of ultra-thin stainless steel, the oxidant of polishing slurry determines the material removal rate (MRR). In this paper, the influences of oxidant in slurry on MRR and surface roughness have been studied in CMP of ultra-thin 304 stainless steel based on alumina (Al2O3) abrasive. The research results show that, in the same conditions, the MRR increases with the increase of the oxidant C and the oxidant B, the MRR decreases with the increase of the oxidant A and the MRR is max with the oxidant C. It indicated that the oxidant C has a large effect on MRR in CMP of the 304 stainless steel. The research results can provide the reference for studying the slurry in CMP of ultra-thin stainless steel.