Formation of submicrometer titanium nitride from a titanium dioxide/phenolic resin composite
Formation of submicrometer titanium nitride from a titanium dioxide/phenolic resin composite
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由二氧化钛/酚醛树脂复合材料形成亚微米氮化钛
DOI：
10.1007/s10853-017-0987-8
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发表时间：
2017-03
影响因子：
4.5
通讯作者：
Kuo-Chih Chou
中科院分区：
文献类型：
--
作者：
Ke-Han Wu;Guo-Hua Zhang;Hai-Peng Gou;Kuo-Chih Chou
以二氧化钛/酚醛树脂复合材料为原料合成亚微米氮化钛。以酚醛树脂为碳源，以二氧化钛为钛源，在1373 ~ 1773 K的超高纯度n2流动气氛中制备氮化钛。将二氧化钛包埋在连续酚醛树脂分散剂中。采用x射线衍射和场发射扫描电镜对其相组成、微观结构和反应机理进行了表征。发现反应顺序为TiO2→Ti4O7→Ti3O5→TiN，整个形成过程由先化学合成反应过程后再结晶—物理过程组成。确定了制备氮化钛粉的最佳工艺条件：二氧化钛与酚醛树脂的摩尔比为1:0.5；恒温温度为1773 K，恒温时间为2 h。产品表面因再结晶形成阶梯状结构。制备的氮化钛粉末粒径约为0.5 μm。
A commercial route has been developed to synthesize submicrometer titanium nitride from titanium dioxide/phenolic resin composite. The phenolic resin served as the carbon source and the titanium dioxide served as titanium source to produce titanium nitride in flowing ultrahigh purity N2atmosphere at 1373–1773 K. Titania was embedded in a continuous phenolic resin dispersant. X-ray diffraction and field emission scanning electron microscope were employed to characterize the phase composition, microstructure and reaction mechanism. It was found that the reaction sequence was TiO2→ Ti4O7→ Ti3O5→ TiN and the whole formation process was consisted of chemical synthesis reaction process firstly and the following recrystalline-physical process. The optimal conditions to prepare titanium nitride powders were determined: the molar ratio of titanium dioxide to phenolic resin is 1:0.5; thermostatic temperature is 1773 K, and thermostatic time is 2 h. The stepped structure on the surface of product formed due to recrystallization. The particle size of the obtained titanium nitride powders is about 0.5 μm.
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影响因子：
29.4
作者：
Wei Li;U. Guler;N. Kinsey;G. Naik;A. Boltasseva;Jianguo Guan;V. Shalaev;A. Kildishev
通讯作者：
Wei Li;U. Guler;N. Kinsey;G. Naik;A. Boltasseva;Jianguo Guan;V. Shalaev;A. Kildishev
DOI：
10.1007/s11663-998-0077-z
发表时间：
1998-10-01
影响因子：
3
作者：
Welham, NJ;Willis, PE
通讯作者：
Willis, PE
影响因子：
3.9
作者：
R. Peelamedu;M. Fleming;D. Agrawal;R. Roy
通讯作者：
R. Peelamedu;M. Fleming;D. Agrawal;R. Roy
影响因子：
4.5
作者：
G. White;K. MacKenzie;J. Johnston
通讯作者：
G. White;K. MacKenzie;J. Johnston
影响因子：
4.5
作者：
Jha, A;Yoon, SJ
通讯作者：
Yoon, SJ