Adhesion of reactive silver inks on indium tin oxide
Adhesion of reactive silver inks on indium tin oxide
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DOI：
10.1007/s10853-018-3017-6
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发表时间：
2018-10
影响因子：
4.5
通讯作者：
Avinash Mamidanna;A. Jeffries;M. Bertoni;O. Hildreth
中科院分区：
文献类型：
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作者：
Avinash Mamidanna;A. Jeffries;M. Bertoni;O. Hildreth
许多新兴光伏技术，例如硅异质结（SHJ）电池和钙钛矿，对温度敏感，并且与商业丝网印刷金属浆料所需的高烧结温度不兼容。新型低温活性银油墨具有良好的导电性，并且与温度敏感基材兼容。然而，初步研究表明，这些金属化层的附着力和可靠性可能会因油墨成分的不同而发生巨大变化。这项工作评估了印刷活性油墨在氧化铟锡涂覆的 SHJ 电池上的粘附性能，结果表明，印刷活性油墨的多孔性质引起的起皱现象是降低印刷粘附强度的原因。使用 180° 剥离测试定性测定粘合性能，然后通过光学成像量化粘合失效的量。印刷后扫描电子显微镜用于观察表面形貌。稀释活性油墨以降低银离子浓度，减少了观察到的起皱现象并提高了附着力性能。这种新的理解使得能够为新颖的光伏应用进行更系统的活性墨水设计。
Many emerging photovoltaic technologies, such as silicon heterojunction (SHJ) cells and perovskites, are temperature sensitive and are not compatible with the high sintering temperatures required for commercial screen-printed metallization pastes. Newer, low-temperature reactive silver inks exhibit good electrical conductivity and are compatible with temperature-sensitive substrates. However, preliminary investigations showed that the adhesion and reliability of these metallizations could vary dramatically with ink composition. This work evaluates the adhesion performance of printed reactive inks on indium tin oxide-coated SHJ cells to show that puckering phenomena originating from the porous nature of the printed reactive inks are responsible for lowering the as-printed adhesion strength. Adhesion performance was qualitatively determined using 180° peel test followed by optical imaging to quantify the amount of adhesive failure. Post-print scanning electron microscopy was used to observe the surface morphology. Diluting the reactive ink to reduce silver ion concentration decreased the observed puckering phenomenon and improved adhesion performance. This new understanding enables a more systematic design of reactive inks for novel photovoltaic applications.