Multistep sequential batch assembly of three-dimensional ferromagnetic microstructures with elastic hinges
Multistep sequential batch assembly of three-dimensional ferromagnetic microstructures with elastic hinges
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DOI：
10.1109/jmems.2005.851814
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发表时间：
2005-12-01
影响因子：
2.7
通讯作者：
Shimoyama, I
中科院分区：
文献类型：
--
作者：
Iwase, E;Shimoyama, I
在本文中，我们已经开发了一个复杂的三维（3-D）铁磁微结构的多步骤顺序批量组装的过程。该工艺使用由垂直于衬底的外部磁场产生的磁力矩来提升铰链结构。我们发现，取决于磁性材料的体积和铰链的刚度的无量纲因子决定了铰链的微结构对磁场的敏感性。该因素被用作设计顺序批量组装工艺的标准，即，用于设置适当的灵敏度差异。在顺序装配设计中引入无量纲因子，简化了装配过程，只需将结构放置在永磁体上，即可进行多步顺序批量装配。我们制作了铰链微结构，其中包括4.5 μ m厚的电镀坡莫合金板和200 nm厚的镍弹性铰链的各种尺寸。在一个实验中，四个板（600 μ m × 800 μ m）依次提起，并在四个步骤的过程中组装平面外的微结构。更复杂的平面外微结构（例如，正四面体;一侧长800 μ m）也显示出使用这种顺序分批组装的方法是可行的。
In this paper, we have developed a process for multistep sequential batch assembly of complex three-dimensional (3-D) ferromagnetic microstructures. The process uses the magnetic torque generated by an external magnetic field perpendicular to the substrate to lift hinged structures. We found that a dimensionless factor that depends on the volume of the magnetic material and the stiffness of the hinges determines the sensitivity of the hinged microstructures to a magnetic field. This factor was used as a criterion in designing a process for sequential batch assembly, i.e., for setting appropriate differences in sensitivity. Using a dimensionless factor in the design of the sequential assembly simplified the assembly process, which requires only placing the structures on a permanent magnet, and which can be used to carry out multistep sequential batch assembly. We fabricated hinged microstructures, which consist of 4.5-mu m-thick electroplated Permalloy plates and 200-nm-thick nickel elastic hinges of various sizes. In an experiment, four plates (600 mu m x 800 mu m) were lifted sequentially and out-of-plane microstructures were assembled in a four-step process. Assembly of more complex out-of-plane microstructures (e.g., regular tetrahedrons; 800 mu m long on one side) was also shown to be feasible using this method of sequential batch assembly.