Damaging mechanism of 3D C/SiC composite with thin interlayer during thermal shock process
Damaging mechanism of 3D C/SiC composite with thin interlayer during thermal shock process
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发表时间：
2009
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影响因子：
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通讯作者：
Meiting Hui
中科院分区：
文献类型：
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作者：
Meiting Hui
To investigate the thermal shock behaviors of 3D C/SiC composite with thin interlayer,thermal shock tests were carried out at 700～1 200 ℃ temperature in Ar gas atmosphere by means of heating generators.The damaging mechanism of 3D C/SiC composite with thin interlayer during thermal shock process was defined based on microstructure,residual tensile strength and thermal stress calculation.The investigation results show that matrix cracking and interface debonding occur during the thermal shock process at 700～1 200 ℃ temperature.The strength decrease of 3D C/SiC composite with thin interlayer results from the matrix cracking and crack extension,and the strength of the composite can be improved by interface debonding.The micro-cracks of matrix reach saturation state after 50 times thermal shock.The strength decrease before saturation and increase after saturation gradually.
