Microchannel Deformation of Polymer Chip in In-Mold Bonding
Microchannel Deformation of Polymer Chip in In-Mold Bonding
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DOI：
10.3139/217.2845
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发表时间：
2014-04-01
影响因子：
1.3
通讯作者：
Jiang, F. -Z.
中科院分区：
文献类型：
--
作者：
Chu, C. -P.;Jiang, B. -Y.;Jiang, F. -Z.
微通道变形是聚合物微流控芯片热键合过程中经常出现的问题，键合参数对微通道变形有重要影响。本文利用蠕变实验得到的聚甲基丙烯酸甲酯（PMMA）的杨氏模量和剪切松弛模量，对聚合物芯片模内键合过程中微通道的变形进行了数值分析。结果表明，微通道的顶壁与两侧壁之间存在粘附，这主要归因于PMMA的粘弹性变形。键合温度对微通道变形的影响大于键合压力和键合时间。在105 ℃、2 MPa、240 s的优化参数下，微通道的变形模拟结果与实验结果基本一致。
Microchannel deformation is a problem which often occurs in the thermal bonding of polymer microfluidic chip, and which is significantly determined by bonding parameters. In this paper, numerical analysis of the microchannel deformation in the process of in-mold bonding polymer chip was conducted, using Young's modulus and shear relaxation modulus of polymethylmethacrylate (PMMA) obtained in creep tests. Adhesion between the top and two lateral walls of microchannel was observed in the results, which can be attributed mainly to the viscoelastic deformation of PMMA. It was also revealed that the maximum percent deformation of microchannel is in height, and that bonding temperature had greater effect on the deformation of microchannel than bonding pressure and bonding time. The deformation of microchannel in simulation were consistent with those of experiment under the optimized parameters of 105 degrees C, 2 MPa and 240 s.