Recrystallization behaviour of SnAgCu solder joints
Recrystallization behaviour of SnAgCu solder joints
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DOI：
10.1016/j.msea.2007.04.013
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发表时间：
2008-02-15
期刊：
影响因子：
6.4
通讯作者：
Lepisto, Tbivo K.
中科院分区：
文献类型：
--
作者：
Sundelin, Janne J.;Nurmi, Sami T.;Lepisto, Tbivo K.
研究了不同SnAgCu焊点、芯片级封装、0402电阻和单搭接剪切试样中锡的再结晶行为。该研究的目的是确定焊料组合物（亚共晶，共晶和过共晶SnAgCu），印刷电路板（PCB）的表面光洁度和锡的再结晶过程中的热机械疲劳和等温蠕变的焊点的类型的影响。结果表明，回流焊后，焊点只由少量锡颗粒组成。在热机械疲劳期间，再结晶在应变集中的位置处成核，即在CSP的颈部区域中、在0402电阻器与PCB之间的焊料中以及在空隙附近。再结晶晶粒促进了沿晶断裂的发生。结果表明，具有亚共晶成分的焊点比具有共晶或过共晶成分的焊点更容易再结晶。(C)2007 Elsevier B.V.保留所有权利。
The recrystallization behaviour of tin in various SnAgCu solder joints, chip-scale packages (CSPs), 0402 resistors and single-overlap shear specimens was studied. The objective of the study was to determine the effect of solder composition (hypoeutectic, eutectic and hypereutectic SnAgCu), the surface finish of printed circuit board (PCB) and the type of the solder joints on the recrystallization of tin during thermomechanical fatigue and isothermal creep. The results show that after reflow the solder joints consist only of a few tin grains. During thermomechanical fatigue recrystallization nucleates at the locations where the strain is concentrated, i.e. in the neck region of CSP, in the solder between the 0402 resistor and PCB and in the vicinity of voids. The recrystallized grains facilitate the occurrence of intergranular fracture. The results indicate that solder joints with hypoeutectic composition have a tendency to recrystallize more readily than joints with eutectic or hypereutectic composition. (C) 2007 Elsevier B.V. All rights reserved.