Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin films
Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin films
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DOI:
10.1557/jmr.1988.0931
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发表时间:
1988-09
影响因子:
2.7
通讯作者:
T. Weihs;Soon Hyung Hong;J. Bravman;W. Nix
中科院分区:
文献类型:
--
作者:
T. Weihs;Soon Hyung Hong;J. Bravman;W. Nix
The mechanical deflection of cantilever microbeams is presented as a new technique for testing the mechanical properties of thin films. Single-layer microbeams of Au and SiO_2 have been fabricated using conventional silicon micromachining techniques. Typical thickness, width, and length dimensions of the beams are 1.0,20, and 30 μm, respectively. The beams are mechanically deflected by a Nanoindenter, a submicron indentation instrument that continuously monitors load and deflection. Using simple beam theory and the load-deflection data, the Young’s moduli and the yield strengths of thin-film materials that comprise the beams are determined. The measured mechanical properties are compared to those obtained by indenting similar thin films supported by their substrate.