High resolution line scan interferometer for solder ball inspection using a visible supercontinuum source
High resolution line scan interferometer for solder ball inspection using a visible supercontinuum source
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DOI：
10.1364/oe.18.022471
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发表时间：
2010-10-11
期刊：
影响因子：
3.8
通讯作者：
Davidson, Douglas
中科院分区：
文献类型：
--
作者：
Kumar, Malay;Islam, Mohammed N.;Davidson, Douglas
线扫描干涉仪，包括一个可见的超连续源耦合到傅里叶域迈克尔逊干涉仪，用于获得类似于300 μ m高的焊接球在半导体芯片上的三维图像，125 nm轴向和15 μ m横向分辨率。测量曲面的能力除了可以确定焊球高度外，还可以确定焊球形状缺陷。我们表明，对于给定的源功率，样品表面法线的最大可测量角倾斜取决于样品的表面粗糙度。作为一个例子，我们演示了高度测量超过+/-20度的正常焊接球和超过+/-60度的粗钢球轴承样品。(C) 2010年美国光学学会
A line scan interferometer, which comprises a visible supercontinuum source coupled to Fourier domain Michelson interferometer, is used to obtain 3D images of similar to 300 mu m high solder balls on a semiconductor die with 125 nm axial and 15 mu m lateral resolution. The ability to measure curved surfaces enables the determination of solder ball shape defects in addition to ball height. We show that the maximum measurable angular tilt from the sample surface normal for a given source power depends on the surface roughness of the sample. As an example, we demonstrate height measurement over +/-20 degrees from the normal on the solder balls and over +/-60 degrees on a rough steel ball bearing sample. (C) 2010 Optical Society of America