Portraying the Countercurrent Flow on Packings by Three-Dimensional Computational Fluid Dynamics Simulations
Portraying the Countercurrent Flow on Packings by Three-Dimensional Computational Fluid Dynamics Simulations
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DOI：
10.1002/ceat.200800273
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发表时间：
2008-10
影响因子：
2.1
通讯作者：
YuanYuan Xu;S. Paschke;J. Repke;Jingqi Yuan;G. Wozny
中科院分区：
文献类型：
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作者：
YuanYuan Xu;S. Paschke;J. Repke;Jingqi Yuan;G. Wozny
填料塔的设计需要对填料表面的流体力学进行详细的描述。为了分析液相的局部流动特性，建立了一种适用于倾斜平板上两相逆流的三维计算流体动力学（CFD）模型。该模型基于流体体积（VOF）方法，考虑了重力、表面张力和两相之间的阻力。这种模型的发展允许研究液体和气体流速对流动行为的影响，如膜流和小溪流。使用文献数据和本工作中进行的实验对模型进行了验证。仿真和实验结果表明，随着液体载荷的减小，平板上的比润湿面积减小。此外，CFD模拟表明，逆流气相的存在会增加膜流的波动和厚度，这与实验数据一致。它还会影响小流的流动特性，并改变膜流和小流的速度分布。另一方面，仿真结果表明，CFD是分析和研究化工流动现象的有力工具。
The design of packed columns requires the detailed description of the hydrodynamics on the surface of the packings. To analyze the local flow behavior of the liquid phase, a three-dimensional Computational Fluid Dynamics (CFD) model was developed that applies to the two-phase countercurrent flow on an inclined and flat plate. This model, based on the volume-of-fluid (VOF) method, considers the gravity, the surface tension and the drag force between the two phases. The development of such a model allows investigation of the influences of the liquid and gas flow rates on the flow behavior such as the film flow and the rivulet flow. A validation of the model was performed using data from the literature and from experiments conducted in this work. Simulation and experimental results demonstrate that the specific wetted area on the plate decreases with decreasing liquid load. Moreover, CFD simulations reveal that the presence of the countercurrent gas phase tends to increase the fluctuation and the thickness of the film flow, which is in accordance with experimental data. It also affects the flow behavior of the rivulet flow and changes the velocity profiles for both film and rivulet flow behavior. On the other hand, the simulation results indicate that CFD is a potent tool for analyzing and investigating the flow phenomena in chemical engineering.