Effects of Cu, Bi, and In on microstructure and tensile properties of Sn-Ag-X(Cu, Bi, In) solders
Effects of Cu, Bi, and In on microstructure and tensile properties of Sn-Ag-X(Cu, Bi, In) solders
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DOI：
10.1007/s11661-005-0236-7
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发表时间：
2005-06-01
影响因子：
2.8
通讯作者：
Wang, L
中科院分区：
文献类型：
--
作者：
Huang, ML;Wang, L
研究了微量Cu、Bi和In对Sn-Ag基无铅钎料组织、熔化温度和拉伸性能的影响。结果发现，金属间化合物（IMC）Ag 2 In和Cu 6Sn 5形成在In和Cu的焊料，分别。在低浓度下，Bi溶解在Sn基质中，并且倾向于在4wt% Bi的溶解度极限下沉淀纯Bi颗粒。当铋合金化到Sn-Ag合金中时，抑制了从焊料基质形成大的Ag 3Sn沉淀物。Bi的添加导致焊料的极限拉伸强度（UTS）的显着线性增加，这是由于固溶硬化机制。由于In和Cu的焊料强化不太明显，并归因于弥散强化机制。Cu、Bi和In的加入均降低了Sn-Ag基钎料的熔化温度，但In的作用最大。
Effects of minor additions of Cu, Bi, and In on microstructure, melting temperature, and tensile properties of Sn-Ag-based lead-free solders were investigated. It was found that the intermetallic compounds (IMCs) Ag2In and Cu6Sn5 are formed in In- and Cu-containing solders, respectively. At low concentration, Bi dissolved in the Sn matrix and tended to precipitate pure Bi particles at the solubility limit of 4 wt pct Bi. The formation of large Ag3Sn precipitates from the solder matrix was suppressed when alloying bismuth into the Sn-Ag alloy. The Bi addition resulted in a significant linear increase of the ultimate tensile strength (UTS) of solders, which is attributed to a solid-solution hardening mechanism. Solder strengthening due to In and Cu is less pronounced and attributed to a dispersion strengthening mechanism. The additions of Cu, Bi, and In all depressed the melting temperatures of Sn-Ag-based solders; however, In is the most effective one.