From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films
From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films
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DOI：
10.1016/j.actamat.2015.07.050
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发表时间：
2015-10
期刊：
影响因子：
9.4
通讯作者：
F.T.N. Vüllers;R. Spolenak
中科院分区：
文献类型：
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作者：
F.T.N. Vüllers;R. Spolenak
钨铜合金通常用于散热片、辐射屏蔽或高性能接触材料。它们的不混溶导致了互穿结构，通常最小的微结构长度尺度在几个微米量级。这项工作集中在将这个长度尺度从原子水平调整到纳米和亚微米范围。这是通过利用两种成分在热力学平衡中的不混溶以及铜对W晶界的不偏析而实现的，从而允许两相的生长。在全浓度范围内对该体系进行了研究，微观结构与力学性能和电学性能均有关系。
W–Cu alloys are typically used for heat sinks, radiation shielding or high performance contact materials. Their immiscibility leads to interpenetrating structures, with typically smallest microstructural length scales on the order of several micrometres. This work focusses on tuning this length scale from the atomic level to the nanometre and submicron range. This is made possible by exploiting the two constituents’ immiscibility in thermodynamic equilibrium as well as the lack of Cu segregation to W grain-boundaries, thus allowing for the growth of the two phases. The system is studied in the complete concentration range and microstructure is related to both mechanical and electronic properties.