Lithographic Micropatterning on the β-PVDF Film Using Reactive Ion Etching Aim for High-Resolution Skin Sensors

Lithographic Micropatterning on the β-PVDF Film Using Reactive Ion Etching Aim for High-Resolution Skin Sensors
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使用反应离子蚀刻目标在 β-PVDF 薄膜上进行光刻微图案化,用于高分辨率皮肤传感器

DOI:
10.1002/tee.22978
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发表时间:
2019
影响因子:
1
通讯作者:
Yutoku Kawabata and Shigeki Tsuchitani
Yutoku Kawabata and Shigeki Tsuchitani
中科院分区:
工程技术4区
文献类型:
--
作者:
Hirofumi Miki;Ryota Sugii;Yutoku Kawabata and Shigeki Tsuchitani

文献摘要

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我们报道了一种使用传统洁净室设备和商业材料制作柔性β相聚偏二氟乙烯(PVDF)薄膜的高保真光刻图形的方法。在我们的过程中,CHF3、CF4和SF6的化学反应气体被用作与O2混合的简单物质。通过控制射频功率、工艺压力、气体种类、O2混合浓度及其质量流量等工艺参数,研究了工艺参数对PVDF干法刻蚀特性的影响。在恒定的射频功率(100 W)和相关的工艺条件下,在厚度为110微米的β-PVDF薄膜上可以实现40-70微米的细线图案和几十微米/小时的高刻蚀速率,而其压电性不会有太大的损失。2019日本电气工程师学会。作者:John Wiley&Sons,Inc.
We report a method for high‐fidelity lithographic patterning of the flexible β‐phase polyvinylidene difluoride (PVDF) film using traditional cleanroom equipment and commercially available materials. In our process, the chemically reactive gas of CHF3, CF4and SF6was used as a simple substance mixed with O2. The effects of process parameters on the PVDF dry etching characteristics were investigated by controlling that of Radio frequency (RF) power, process pressure, gas type and the mixed concentration in O2as well as its mass flow rate. At a constant RF power (100 W) and associated process conditions, 40–70 µm of fine‐line patterns and several tens µm/h of high etch rate could be realized on a 110 µm‐thick β‐PVDF film without much loss of its piezoelectricity. © 2019 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.