Cu-7Cr-0.1Ag Microcomposites Optimized for High Strength and High Condutivity

Cu-7Cr-0.1Ag Microcomposites Optimized for High Strength and High Condutivity
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针对高强度和高电导率进行优化的 Cu-7Cr-0.1Ag 微复合材料

DOI:
10.1007/s11665-018-3221-1
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发表时间:
2018-02
影响因子:
2.3
通讯作者:
Deping Lu
Deping Lu
中科院分区:
材料科学4区
文献类型:
--
作者:
Keming Liu;Zhenxi Wang;Zhengyi Jiang;Andrej Atrens;Zhikai Huang;Wei Guo;Xingwang Zhang;Jiuming Yu;Quanguo Lu;Deping Lu

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This paper (i) investigated how the microstructure, conductivity, and mechanical properties of Cu-7Cr0.1Ag microcomposites were changed by cold drawing and subsequent heat treatment, and (ii) produced the Cu-7Cr-0.1Ag microcomposite with an optimum combination of strength and conductivity. The figure of merit Z (combining strength and conductivity) of the Cu-7Cr-0.1Ag microcomposite was larger than that of the microcomposite without silver for each heat treatment. The value of Z of the Cu-7Cr-0.1Ag microcomposite was a maximum after heat treatment for 1 h at 600 C, indicating that this was the optimum intermediate heat treatment. The following combinations of conductivity, strength and ductility (measured as elongation to fracture) were obtained by the Cu-7Cr-0.1Ag microcomposite with g = 8: (i) 77.9% IACS (International Annealed Copper Standard), 920 MPa and 3.1%; (ii) 79.3% IACS, 880 MPa and 3.3%; and (iii) 79.9% IACS, 798 MPa and 3.5%. These values for the Cu-7Cr-0.1Ag microcomposite were larger than those of the Cu-7Cr microcomposite..
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