An interaction energy integral method for nonhomogeneous materials with interfaces under thermal loading
An interaction energy integral method for nonhomogeneous materials with interfaces under thermal loading
复制标题
热载荷下界面非均质材料的相互作用能积分方法
DOI：
10.1016/j.ijsolstr.2011.10.012
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发表时间：
2012-01
影响因子：
3.6
通讯作者：
Zhang Li
中科院分区：
文献类型：
--
作者：
Guo Licheng;Guo Fengnan;Yu Hongjun;Zhang Li
研究了具有界面的非均匀材料在静态热载荷作用下的平面裂纹问题。提出了一种改进的相互作用能积分法（IEIM），用于求解混合型热应力强度因子（TSIF）。与已有的IEIM相比，本文的创新点在于：在热载荷作用下，修正的IEIM在具有界面的非均匀材料中仍然保持区域无关性。因此，即使积分域中包含界面，修正的IEIM方法仍然可以用于求解非均匀材料的应力强度因子。将改进的IEIM与扩展有限元法（XFEM）相结合，求解了几种非均匀材料的热断裂问题。通过与解析解的比较，验证了IEIM的区域独立性。因此，该方法对研究非均匀材料的应力强度因子是有效的，即使材料中含有界面。研究了材料性质（热膨胀系数、导热系数和杨氏模量）的不连续性对TSIF的影响。结果表明，热膨胀系数和杨氏模量的不连续性对TSIF的影响较大，而导热系数的不连续性对TSIF的影响不明显。
A plane crack problem of nonhomogeneous materials with interfaces subjected to static thermal loading is investigated. A modified interaction energy integral method (IEIM) is developed to obtain the mixed-mode thermal stress intensity factors (TSIFs). Compared with the previous IEIM, the original point of this paper is: the domain-independence of the modified IEIM still stands in nonhomogeneous materials with interfaces under thermal loading. Therefore, the modified IEIM can still be applied to obtain the TSIFs of nonhomogeneous material even if the integral domain includes interfaces. The modified IEIM is combined with the extended finite element method (XFEM) to solve several thermal fracture problems of nonhomogeneous materials. Good agreement can be obtained compared with the analytic solutions and the domain-independence of the IEIM is verified. Therefore, the present method is effective to study the TSIFs of nonhomogeneous materials even when the materials contain interfaces. The influence of the discontinuity of the material properties (thermal expansion coefficient, thermal conductivity and Young’s modulus) on the TSIFs is investigated. The results show that the discontinuity of both thermal expansion coefficient and Young’s modulus affects the TSIFs greatly, while the discontinuity of thermal conductivity does not arouse obvious change of the TSIFs.
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