A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages
A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages
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DOI：
10.1115/imece1999-0967
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发表时间：
1999-11
期刊：
影响因子：
--
通讯作者：
T. M. Ying;K. Toh
中科院分区：
文献类型：
--
作者：
T. M. Ying;K. Toh
收缩电阻模型用于球栅阵列 (BGA) 封装焊球接点的热分析。焊点的散热行为也通过有限元建模（FEM）进行分析，并与分析模型进行比较。由于 BGA 焊点的几何复杂性，详细分析了收缩电阻和扩散电阻的原理。焊点的总电阻包括内阻和外阻。内阻是分析的重点，由材料阻力和收缩阻力组成。它是材料电导率、热边界条件和几何参数的函数。 FEM 解与单焊球接头和多焊球接头的热阻分析结果非常吻合。分析电阻可以准确预测焊球阵列上的温降，从而预测 BGA 封装的整体性能。间距尺寸是研究焊球接头散热情况的主要参数。
The constriction resistance model is employed for the thermal analysis at the solder ball joint of a Ball Grid Array (BGA) package. The behavior of heat dissipation in solder joint is also analyst through Finite Element Modeling (FEM) and compared with the analytical model. The principle of constriction and spreading resistances is analyzed in detail because of the geometrical complexity encountered in BGA solder joints. The total resistance across the solder joint includes the internal resistance and external resistance. The internal resistance, which is the main focus of the analysis, consists of material resistance and constriction resistance. It is a function of material conductivity, thermal boundary conditions and geometric parameters. FEM solutions are in good agreement with analytical results of thermal resistance for single solder ball joint and multiple solder ball joints. The analytical resistance provides an accurate prediction on the temperature drop across the array of solder balls and hence the overall performance of the BGA packages. The pitch size is the main parameter in the investigation to study the heat dissipation of solder ball joints.