Bridging silicon nanoparticles and thermoelectrics: phenylacetylene functionalization.
Bridging silicon nanoparticles and thermoelectrics: phenylacetylene functionalization.
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DOI：
10.1039/c4fd00109e
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发表时间：
2014
影响因子：
3.4
通讯作者：
S. Ashby;Jason A. Thomas;J. García-Cañadas;G. Min;Jack Corps;A. Powell;Hualong Xu;W. Shen;Y. Chao
中科院分区：
文献类型：
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作者：
S. Ashby;Jason A. Thomas;J. García-Cañadas;G. Min;Jack Corps;A. Powell;Hualong Xu;W. Shen;Y. Chao
硅是目前热电材料(Bi（2)Te(3)）的一个有前途的替代品。硅纳米颗粒基材料由于其大量的界面而表现出特别低的热导率，这增加了观察到的声子散射。这些材料的主要障碍是保持高导电性。用苯乙炔进行表面功能化，其电导率为18.1 S m(-1)， Seebeck系数为328.8 μV K(-1)，导热系数为0.1 W K(-1) m（-1）。这使得在300 K时ZT为0.6，这对于大块硅基材料来说是非常重要的，并且与其他热电材料（如Mg(2)Si， PbTe和SiGe合金）相似。
Silicon is a promising alternative to current thermoelectric materials (Bi(2)Te(3)). Silicon nanoparticle based materials show especially low thermal conductivities due to their high number of interfaces, which increases the observed phonon scattering. The major obstacle with these materials is maintaining high electrical conductivity. Surface functionalization with phenylacetylene shows an electrical conductivity of 18.1 S m(-1) and Seebeck coefficient of 3228.8 μV K(-1) as well as maintaining a thermal conductivity of 0.1 W K(-1) m(-1). This gives a ZT of 0.6 at 300 K which is significant for a bulk silicon based material and is similar to that of other thermoelectric materials such as Mg(2)Si, PbTe and SiGe alloys.