Microstructure Evolution and Recrystallization Resistance of a 7055 Alloy Fabricated by Spray Forming Technology and by Conventional Ingot Metallurgy
Microstructure Evolution and Recrystallization Resistance of a 7055 Alloy Fabricated by Spray Forming Technology and by Conventional Ingot Metallurgy
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喷射成形技术和传统铸锭冶金制备的 7055 合金的显微组织演变和抗再结晶能力
DOI：
10.1007/s11661-020-05931-w
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发表时间：
2020-08
影响因子：
2.8
通讯作者：
Liu Qing
中科院分区：
文献类型：
--
作者：
Xie Zhiqiang;Jia Zhihong;Xiang Kaiyun;Kong Yaping;Li Zhenguo;Fan Xi;Ma Wantai;Zhang Hao;Lin Lin;Marthinsen Knut;Liu Qing
采用光学显微镜(OM)、扫描电子显微镜(SEM)、电子探针X射线显微分析仪(EPMA)和透射电子显微镜(TEM)研究了不同制备工艺(喷射成形和常规铸造)和均匀化处理对7055合金显微组织的影响。结果表明，沉积(喷射成形)7055合金的晶粒度仅为铸态7055合金的一半，未见Al2CuMg相沿晶界分布于粗大的镁(锌，铜，铝)相中。在7055合金中没有观察到锆的偏析。在350℃/5h+470℃/24h的均匀化加热条件下，传统铸造7055合金中的Al3Zr弥散相在晶内分布不均匀，而喷射成形7055合金中的Al3Zr弥散相在晶内分布更加均匀。与传统的铸造7055合金相比，喷射成形7055合金中弥散分布均匀的Al3Zr更有效地抑制了再结晶。本研究突出了喷射成形技术在改善7055合金组织方面的优势。
The effect of different fabricating processes (spray forming and conventional casting) and homogenization treatment on the microstructure of an 7055 alloy was investigated by optical microscopy (OM), scanning electron microscopy (SEM), electron probe X-ray micro-analyzer (EPMA), and transmission electron microscopy (TEM). It was found that the grain size of the as-deposited (spray formed) 7055 alloy had half the size as that of the as-cast 7055 alloy and there was no Al2CuMg phase that embedded in the coarse Mg(Zn, Cu, Al)2phase distributed along the grain boundaries in the as-deposited 7055 alloy. No segregation of zirconium was observed in the as-deposited 7055 alloy. After homogenization heating at 350 °C/5 hours + 470 °C/24 hours, Al3Zr dispersoids were inhomogeneously distributed within grains in the traditionally cast 7055 alloy, while more homogeneously distributed within grains in the spray-formed 7055 alloy. Compared with the traditional cast 7055 alloy, the uniform distribution of Al3Zr dispersoids in the spray-formed 7055 alloy retards recrystallization more effectively. This investigation highlights the advantage of spray forming technology on improving microstructure of a 7055 alloy.
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DOI：
10.1016/s1003-6326(11)61398-8
发表时间：
2012-08-01
影响因子：
4.5
作者：
Jia Zhi-hong;Couzinie, Jean-Philippe;Massinon, Denis
通讯作者：
Massinon, Denis
DOI：
10.1136/bmj.323.7325.1375/a
发表时间：
2001-12
期刊：
BMJ : British Medical Journal
影响因子：
--
作者：
K. Barraclough
通讯作者：
K. Barraclough
影响因子：
4.7
作者：
Q. Zang;Huashun Yu;Y. Lee;Minseok Kim;Hyoung-Wook Kim
通讯作者：
Q. Zang;Huashun Yu;Y. Lee;Minseok Kim;Hyoung-Wook Kim
影响因子：
4.7
作者：
Guo, Zhanying;Zhao, Gang;Chen, X. -Grant
通讯作者：
Chen, X. -Grant
DOI：
10.1007/s11661-007-9283-6
发表时间：
2007-10-01
影响因子：
2.8
作者：
Knipling, Keith E.;Dunand, David C.;Seidman, David N.
通讯作者：
Seidman, David N.