Evaluation of Fatigue Crack Propagation of Sn-5.0Sb/Cu Joint Using Inelastic Strain Energy Density
Evaluation of Fatigue Crack Propagation of Sn-5.0Sb/Cu Joint Using Inelastic Strain Energy Density
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DOI:
10.2320/matertrans.mh201813
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发表时间:
2019-01-01
影响因子:
1.2
通讯作者:
Kariya, Yoshiharu
中科院分区:
文献类型:
--
作者:
Nakajima, Yuta;Ono, Keisuke;Kariya, Yoshiharu
In this study, evaluation of fatigue crack properties in the Sn-5.0Sb/Cu joint was performed by using the inelastic strain energy density W-in around the crack tip which was calculated by FEM. Win-c given by the multiplication of W-in obtained from an arbitrary-sized square region surrounding the crack tip by the side length of the square region-did not depend on the size of the square region and the element size. The fatigue crack propagated in the solder layer and the power law of Paris law type between its fatigue crack propagation rate and Delta Win-c held. However, the power exponent in the fatigue crack propagation law differed depending on the regions of Delta Win-c. The power exponent became about 1 in the low Delta Win-c region and very large in the high Delta Win-c region. In the low Delta Win-c region, fatigue fracture propagated along the high angle grain boundaries formed ahead of the crack by the continuous dynamic recrystallization. On the other hand, the fracture transformed to static fracture mode in the high Delta Win-c region and the cleavage fracture was observed. The large power exponent in the high Delta Win-c region was attributed to the cleavage fracture.