Multilayer Fabrication of Micromolding and Electroforming with the Planarization of Grinding for High-Aspect-Ratio Microelectrodes in Electro-conjugate Fluid (ECF) Micropumps
Multilayer Fabrication of Micromolding and Electroforming with the Planarization of Grinding for High-Aspect-Ratio Microelectrodes in Electro-conjugate Fluid (ECF) Micropumps
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DOI：
10.1007/s12541-019-00299-3
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发表时间：
2020-01
影响因子：
1.9
通讯作者：
Dong Han;Yoshiho Yamada;S. Yokota;Joon-wan Kim
中科院分区：
文献类型：
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作者：
Dong Han;Yoshiho Yamada;S. Yokota;Joon-wan Kim
在此之前，我们描述了一个单层制造相结合的厚光刻胶（KMPR）微成型和电铸制造ECF微泵与三角棱镜和狭缝电极对（TPSEs）。然而，由于KMPR微模具的严重膨胀和变形导致的KMPR的纵横比的限制，所制备的TPSE具有高度限制。为了解决这个问题，实现高纵横比TPSEs，我们建议利用多层制造而不是单层。在每个先前的微成型层制造之后，引入精密表面研磨技术以实现第一层和第二层之间的KMPR微模具和电镀TPSE的优异平坦化。我们应用这种方法成功地制作了高度为880 μm的TPSE的三维集成ECF微泵（3D-EMP）。此外，我们通过实验研究和比较由双层TPSEs和以前的单层的ECF微泵的输出性能，验证了这种方法。结合多层微成型和电铸与平面化的MEMS制造方法是有前途的，适用于广泛的高深宽比的金属微结构。
Previously, we described a single layer fabrication combining thick photoresist (KMPR) micromolding and electroforming to fabricate ECF micropumps with triangular prism and slit electrode pairs (TPSEs). However, the fabricated TPSEs have a height limitation due to the limitation of KMPR’s aspect ratio caused by serious swelling and deformation of KMPR micromolds. To solve this problem and realize high-aspect-ratio TPSEs, we propose to utilize the multilayer fabrication instead of the single layer one. After each prior micromolding layer fabrication, the precision surface grinding technique is introduced to achieve the excellent planarization of the KMPR micromolds and electroplated TPSEs between the first layer and the second one. We apply this method to successfully fabricate the 3D-integration ECF micropump (3D-EMP) with TPSEs of 880 µm in height. Also, we validate this method by experimentally investigating and comparing the output performance of ECF micropumps composed of double layer TPSEs and previous single layer ones. The novel MEMS fabrication method combining multilayer micromolding and electroforming with the planarization is promising and applicable to a broad range of high-aspect-ratio metallic microstructures.