Electron heating in capacitively coupled plasmas revisited
Electron heating in capacitively coupled plasmas revisited
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DOI：
10.1088/0963-0252/23/3/035010
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发表时间：
2014-06-01
影响因子：
3.8
通讯作者：
Booth, J. P.
中科院分区：
文献类型：
--
作者：
Lafleur, T.;Chabert, P.;Booth, J. P.
我们重新审视电容耦合等离子体（CCP）中的电子加热问题，并提出了一种方法，用于量化等离子体模拟中的碰撞加热和无碰撞加热的水平。所提出的程序，电子机械能守恒方程的基础上，证明了一些单频和多频CCP的研究和工业利益的制度中操作的粒子在细胞模拟。在几乎所有的测试情况下，总的电子加热是由碰撞（欧姆）和压力加热部分。这后一种无碰撞成分与最近重新评估的理论模型预测的电子加热机制定性一致。最后，在非常电不对称的等离子体中产生的多频放电，我们观察到一个额外的无碰撞加热机制与电子惯性。
We revisit the problem of electron heating in capacitively coupled plasmas (CCPs), and propose a method for quantifying the level of collisionless and collisional heating in plasma simulations. The proposed procedure, based on the electron mechanical energy conservation equation, is demonstrated with particle-in-cell simulations of a number of single and multi-frequency CCPs operated in regimes of research and industrial interest. In almost all cases tested, the total electron heating is comprised of collisional (ohmic) and pressure heating parts. This latter collisionless component is in qualitative agreement with the mechanism of electron heating predicted from the recent re-evaluation of theoretical models. Finally, in very electrically asymmetric plasmas produced in multi-frequency discharges, we observe an additional collisionless heating mechanism associated with electron inertia.