Packaging image sensor devices for camera module applications
Packaging image sensor devices for camera module applications
复制标题
封装用于相机模块应用的图像传感器器件
DOI：
10.1109/itherm.2004.1319149
复制
发表时间：
2004
期刊：
影响因子：
--
通讯作者：
Sung Soon Park
中科院分区：
文献类型：
--
作者：
R. Darveaux;A. Chowdhury;J. Tomé;R. Schoonejongen;M. Reifel;A. De Guzman;Sung Soon Park
近年来，由于手机中相机模块的广泛采用，图像传感器设备的生产急剧增加。预计2004年将有超过1.5亿个摄像头模块被用于手机。在相机模块中封装图像传感器提出了几个独特的工程挑战。材料选择、装配工艺、光学测试和设备控制都是技术快速发展的领域。本文着重于当前的挑战，并强调了需要在研究和开发方面取得进展的几个领域。
Production of image sensor devices has increased dramatically in recent years due to wide scale adoption of camera modules in mobile phones. It is expected that over 150M camera modules will be shipped in mobile phones in 2004. The packaging of an image sensor in a camera module presents several unique engineering challenges. Materials selection, assembly process, optical test, and facilities control are all areas where technology is rapidly developing. This paper focuses on current challenges, and highlights several areas where advances in research and development are needed.