The microtensile bond strength of self-etching adhesives to ground enamel
The microtensile bond strength of self-etching adhesives to ground enamel
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DOI：
10.2341/05-38
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发表时间：
2006-05-01
影响因子：
2.2
通讯作者：
Pashley, D. H.
中科院分区：
文献类型：
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作者：
Brackett, W. W.;Ito, S.;Pashley, D. H.
单相自蚀刻胶粘剂与牙釉质的结合是否像蚀刻-冲洗胶粘剂那样可靠还不确定。本研究比较了三种自蚀刻胶粘剂系统、自蚀刻底漆系统和蚀刻-冲洗胶粘剂系统的微拉伸粘接强度。用320粒碳化硅纸将人的牙釉质磨平。按照指导使用了自蚀刻粘合剂iBond (Heraeus Kulzer), Prompt L-Pop （3M ESPE）和Xeno III (Caulk/Dentsply)，带有自蚀刻底漆的粘合剂Clearfil SE Bond （Kuraray）和蚀刻冲洗粘合剂Scotchbond multipurpose (3M/ESPE)，然后使用了同一制造商的混合树脂复合材料的核心。在水储存48小时后，使用横截面积约0.9 mm(2)的未修剪梁，以0.6 mm/分钟的十字速度进行微拉伸粘结强度评估。在任何组中都没有预试失败，失败主要是粘合或混合。与Scotchbond Multi-Purpose相比，Clearfil SE对牙釉质的粘结力没有显著差异，而三种自蚀刻粘结剂系统的粘结力明显较低(单向方差分析，Tukey-Kramer多重比较检验，p
It is uncertain whether single-phase self-etching adhesives form bonds to enamel as reliable as those of etch-and-rinse adhesives. This study compared the microtensile bond strengths to ground enamel of three self-etching adhesive systems, a self-etching primer system and an etch-and-rinse adhesive system. Human enamel was ground flat with 320-grit silicone carbide paper. The self-etching adhesives iBond (Heraeus Kulzer), Prompt L-Pop (3M ESPE) and Xeno III (Caulk/Dentsply), the adhesive with a self-etching primer Clearfil SE Bond (Kuraray) and the etch-and-rinse adhesive Scotchbond Multipur-pose (3M/ESPE) were applied as directed, followed by a core of the same manufacturers' hybrid resin composite. A microtensile bond strength evaluation was performed after 48 hours of water storage, using untrimmed beams approximately 0.9 mm(2) in cross-sectional area at a crosshead speed of 0.6 mm/minute. There were no pretest failures in any group, and failures were predominately adhesive or mixed. Adhesion to enamel of Clearfil SE was not significantly different from Scotchbond Multi-Purpose, while the three self-etching adhesive systems demonstrated significantly lower bond strengths (One-way ANOVA, Tukey-Kramer Multiple-Comparison Test, p