Effect of negative substrate bias on the microstructure and mechanical properties of Ti–Si–N films deposited by a hybrid filtered cathodic arc and ion beam sputtering technique
Effect of negative substrate bias on the microstructure and mechanical properties of Ti–Si–N films deposited by a hybrid filtered cathodic arc and ion beam sputtering technique
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DOI：
10.1016/j.apsusc.2012.03.127
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发表时间：
2012-07
影响因子：
6.7
通讯作者：
Yujuan Zhang;Yingze Yang;Yu-Hao Zhai;Ping-yu Zhang
中科院分区：
文献类型：
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作者：
Yujuan Zhang;Yingze Yang;Yu-Hao Zhai;Ping-yu Zhang
采用混合阴极电弧和离子束溅射方法合成Ti-Si-N薄膜。利用XRD、XPS、HRTEM、纳米压痕仪等研究了基底负偏压对结构和力学性能的影响。随着负偏压的增加，TiN 微晶尺寸从 36 nm 减小到 10 nm。负衬底偏压促进了 nc-TiN/a-Si3N4 纳米复合结构的构象，具有完全的相分离和均匀的晶粒尺寸。在100V负偏压下成功合成了最高硬度为46GPa的超硬TiSiN薄膜。在200V和300V负基偏压下沉积的薄膜由于沉积速率的降低而发生严重氧化，导致薄膜的硬度分别降低至26GPa和22GPa。
A hybrid cathodic arc and ion beam sputtering method was employed to synthesize Ti–Si–N films. The influence of negative substrate bias on the structure and mechanical properties was investigated by using XRD, XPS, HRTEM, nanoindentor and so on. With the increasing of negative bias there is a decrease in the TiN crystallite size from 36nm to 10nm. Negative substrate bias promoted the conformation of nc–TiN/a–Si3N4nanocomposite structure with complete phase separation and uniform crystallite size. Superhard TiSiN films with a maximum hardness of 46GPa were successfully synthesized under 100V negative bias. Severe oxidation occurred in films deposited under 200V and 300V negative substrate bias due to the decreasing of deposition rate, which led to the hardness of films reduced to the value of 26GPa and 22GPa respectively.