A Review of Insulation Challenges and Mitigation Strategies in (U)WBG Power Modules Packaging
A Review of Insulation Challenges and Mitigation Strategies in (U)WBG Power Modules Packaging
复制标题
DOI：
10.1109/tpec60005.2024.10472278
复制
发表时间：
2024-02
期刊：
影响因子：
--
通讯作者：
Pujan Adhikari;Mona Ghassemi
中科院分区：
文献类型：
--
作者：
Pujan Adhikari;Mona Ghassemi
在电力需求不断增长的背景下，电力电子模块封装的未来在于宽带隙 (WBG) 材料领域，包括碳化硅 (SiC)、氮化镓 (GaN) 以及金刚石、氮化铝 (AlN) 和六方氮化硼 (h-BN) 等尖端超宽带隙 (UWBG) 材料。这些材料提供了比传统硅基器件更优越的性能，有望提高功率密度、减轻重量并提高工作温度、电压和频率。然而，突破电力电子模块的界限给绝缘系统带来了挑战，因为封装材料和陶瓷基板可能无法承受功能参数，可能导致高场应力和局部放电 (PD) 等不利条件，最终导致绝缘故障。本文基于近年来WBG封装的研究成果，对电力电子器件中使用的电绝缘材料的特性进行了深入分析。检查了三相点 (TP) 处最大电场应力的重要性。此外，本文还回顾了用于缓解封装和基板材料中最大场应力和局部放电相关挑战的策略和技术。结论是，缓解策略在改善封装绝缘系统方面很有前景，但研究缺乏在 WBG 功率模块实际运行条件下的实施。
In the ever-growing landscape of electrical power demand, the future of power electronics module packaging lies in the realm of wide-bandgap (WBG) materials, including silicon carbide (SiC), gallium nitride (GaN), and cutting-edge ultra WBG (UWBG) materials like diamond, aluminum nitride (AlN), and hexagonal-boron nitride (h-BN). These materials offer superior properties to traditional silicon-based devices, promising higher power density, reduced weight, and increased operating temperature, voltage, and frequency. However, pushing the boundaries for power electronics modules presents challenges in insulation systems as the encapsulation material and the ceramic substrate may not withstand the functional parameters, potentially leading to unfavorable conditions like high field stress and partial discharge (PD), ultimately resulting in insulation failure. This paper presents a thorough analysis of the characteristics of the electrical insulation materials used in power electronics devices based on the research in WBG packaging conducted in recent years. The significance of maximum electric field stress at triple points (TPs) is examined. Furthermore, the paper reviews the strategies and techniques employed to mitigate the challenges related to maximum field stress and PDs in both encapsulation and substrate materials. It is concluded that the mitigation strategies are promising in improving insulation systems for packaging, but the studies lack their implementation under actual operating conditions of WBG power modules.