Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys
Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys
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无铅 Sn-Ag-Cu + Ni-Ge 焊料合金的蠕变行为
DOI：
10.1007/s11664-009-0689-3
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发表时间：
2009
影响因子：
2.1
通讯作者：
M. Yoshiba
中科院分区：
文献类型：
--
作者：
N. Hidaka;H. Watanabe;M. Yoshiba
为了提高焊料合金的机械性能，我们开发了一种新的无铅焊料合金，即在Sn-Ag-Cu基中添加少量的Ni和Ge。研究了Sn-3.5Ag-0.5Cu-Ni-Ge和Sn-3.0Ag-0.5Cu两种无铅钎料合金在高温下的体相和通孔相蠕变变形，发现在398 K下，Sn-3.5Ag-0.5Cu-Ni-Ge钎料合金的蠕变持久寿命比Sn-3.0Ag-0.5Cu钎料合金的高3倍以上。添加镍的焊料似乎使微观结构的发展更精细和更均匀。添加到焊料中的Ni容易与Cu结合以形成稳定的金属间化合物（Cu，Ni）6Sn 5，其能够改善焊料合金的蠕变行为。此外，基于透射电子显微镜分析的微观结构表征详细观察蠕变行为表明，Sn-3. 5Ag-0.5Cu-Ni-Ge焊料合金中的这种颗粒防止位错和运动。
We developed a new lead-free solder alloy, an Sn-Ag-Cu base to which a small amount of Ni and Ge is added, to improve the mechanical properties of solder alloys. We examined creep deformation in bulk and through-hole (TH)␣form for two lead-free solder alloys, Sn-3.5Ag-0.5Cu-Ni-Ge and Sn-3.0Ag-0.5Cu, at elevated temperatures, finding that the creep rupture life of the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy was over three times better than that of the Sn-3.0Ag-0.5Cu solder at 398 K. Adding Ni to the solder appears to make microstructural development finer and more uniform. The Ni added to the solder readily combined with Cu to form stable intermetallic compounds of (Cu, Ni)6Sn5capable of improving the creep behavior of solder alloys. Moreover, microstructural characterization based on transmission electron microscopy analyses observing creep behavior in detail showed that such particles in the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy prevent dislocation and movement.