Hybrid additive manufacturing based on vat photopolymerization and laser-activated selective metallization for three-dimensional conformal electronics
Hybrid additive manufacturing based on vat photopolymerization and laser-activated selective metallization for three-dimensional conformal electronics
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DOI：
10.1016/j.addma.2023.103388
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发表时间：
2023-01-14
影响因子：
11
通讯作者：
Yan, Yan
中科院分区：
文献类型：
--
作者：
Wang, Peiren;Li, Ji;Yan, Yan
Hybrid additive manufacturing technology (HAM) is a great advance of traditional additive manufacturing (AM) processes which enables the direct fabrication of full-functional end-use products rather than individual parts. Three-dimensional (3D) printed electronics is a representative product of HAM that could meet customized functional requirements of the industrial community such as consumer electronics, communication engineering, and automobile and aerospace industries. Herein, we propose a novel HAM technology that combines vat photopolymerization (VPP) 3D printing and the laser-activated electroless plating (ELP) process to fabricate conformal 3D printed electronics. A novel functional liquid photopolymer doped with 3 wt% of antimony tin oxide (ATO) and 1 wt% of titania (TiO2) nanoparticles is developed for this HAM technology. The 3D substrate can be successfully fabricated layer-by-layer with this functional photopolymer by a commercial desktop VPP 3D printer. A near-infrared (NIR) laser system selectively activates the surface of the 3D substrate and induces the SnII seeds for ELP. For 4-hour ELP, the thickness of plated copper layer approaches 11 mu m and the electrical conductivity reaches 5.2 x 107 S/m which is close to pure copper (5.8 x107 S/m). Finally, a selectively copper plated university badge is prepared to demonstrate the fabrication accuracy of the HAM technology, and a 3D conformal light-emitting diode (LED) circuit board is also developed to verify the feasibility of this HAM tech-nology for customizing full-functional electronic products.
