Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging
Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging
复制标题
高压高温电力电子封装密封剂的表征
DOI：
10.1109/tcpmt.2011.2173344
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发表时间：
2010
期刊：
影响因子：
--
通讯作者：
K. Ngo
中科院分区：
文献类型：
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作者：
Yiying Yao;Zheng Chen;G. Lu;D. Boroyevich;K. Ngo
本文研究了七种工作温度高达250 °C的高温大功率平面封装用制冷剂。可加工性是通过研究流动前沿和固化性能的调查材料之间的刮板。材料B在流动测试中失败，因为它在几秒钟内干燥。材料A、C和D未通过固化性测试，因为A和C在固化期间显示体积收缩，而D由于其脆性在固化后开裂。据发现，通常对应于低玻璃化转变温度（Tg）的弹性材料往往表现更好的大面积平面结构封装。材料E-G被证实相对于温度是相对稳定的，并且随着温度从25 ° C增加到250 °C，介电强度和介电常数分别降低约40%和30%。热老化试验表明，材料在老化过程中发生硬化。与此同时，在材料基体中开始开裂。一旦发生破裂，样品的介电强度下降60-70%，仅为约10 kV/mm。
Seven encapsulants with operating temperature up to 250 °C are surveyed for possible use in high-temperature high-power planar packages. Processability is assessed by studying the flow fronts and the cured properties of the surveyed materials between paralleled plates. Material B failed in the flow test because it dried out in seconds. Materials A, C, and D failed the curability test because A and C showed volume shrinkage during curing, while D cracked after curing owing to its brittle nature. It is found that elastic materials that usually correspond to low glass transition temperatures (Tg) tend to perform better with regard to large-area planar-structure packages. Materials E-G are confirmed to be comparatively stable with respect to temperature, and both dielectric strength and dielectric permittivity decrease by about 40 and 30%, respectively, as the temperature is increased from 25 to 250 °C. The thermal aging test show that the materials harden during the aging process. Meanwhile, cracking starts in the material matrix. The dielectric strength of the sample drops by 60-70% to only around 10 kV/mm once cracking occurs.