Toward the realization of subsurface volumetric integrated optical systems
Toward the realization of subsurface volumetric integrated optical systems
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DOI：
10.1063/5.0059354
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发表时间：
2021-09-27
影响因子：
4
通讯作者：
Braun, Paul V.
中科院分区：
文献类型：
--
作者：
Richards, Corey A.;Ocier, Christian R.;Braun, Paul V.
下一代移动的设备和计算架构将受益于高效传输和处理光信号的超高带宽技术。次表面制造可以通过形成具有比平面片上电路更紧凑的空中覆盖区的体积光子集成电路来解决这一挑战。这些3D光学系统可以利用密集封装的低损耗、自由形式的光学互连用于高容量数据传输。在这个角度来看，我们提供了一个比较概述的两种主要方法的地下制造，包括我们最近开发的SCRIBE过程，并评估每种方法的优势和未来的发展方向。在分析了基础技术之后，我们提供了一个重要步骤的路线图，从单个元件的实验室演示过渡到地下体积光子集成电路的工业规模生产。由AIP Publishing独家授权出版。
Next generation mobile devices and computing architectures would benefit from ultra-high bandwidth technologies that efficiently transport and process optical signals. Subsurface fabrication can address this challenge by forming volumetric photonic integrated circuits with a more compact aerial footprint than planar on-chip circuits. These 3D optical systems may utilize densely packed low-loss, freeform optical interconnects for high volume data transfer. In this Perspective, we provide a comparative overview of the two main methods for subsurface fabrication, including our recently developed SCRIBE process, and assess the advantages and future directions of each approach. After analyzing the underlying technologies, we provide a roadmap of important steps to transition from laboratory demonstrations of individual elements to industrial-scale production of subsurface volumetric photonic integrated circuits. Published under an exclusive license by AIP Publishing.