LTCC-M: an enabling technology for high performance multilayer RF systems
LTCC-M: an enabling technology for high performance multilayer RF systems
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DOI：
10.1109/mtttwa.1999.755160
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发表时间：
1999
期刊：
影响因子：
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通讯作者：
B. Geller;B. Thaler;A. Fathy;M. Liberatore;H.D. Chen;G. Ayers;V. Pendrick;Y. Narayan
中科院分区：
文献类型：
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作者：
B. Geller;B. Thaler;A. Fathy;M. Liberatore;H.D. Chen;G. Ayers;V. Pendrick;Y. Narayan
在过去的几年里，以客户为导向的无线市场推动了射频硬件的开发商朝着体积更小、工作频率越来越高、电路和功能集成度更高的方向发展。此外，降低成本的压力迫使设计师考虑成本较低的制造、组装和测试技术。多层和多芯片系统集成技术已经以许多不同的格式实现，每种格式都有其优点和缺点。在高温陶瓷上使用混合技术通常可以获得最佳性能，而使用几种有机(或“软”)板技术通常可以实现最低成本。低温共烧陶瓷(LTCC)技术具有同时提供高性能和低成本的潜力。然而，在其基本版本中，它存在两个主要缺陷。首先，陶瓷在所有三个维度烧成后都会收缩。这限制了可加工的电路板的尺寸，对嵌入的无源元件施加了限制，并增加了具有空洞的电路板的加工的复杂性。此外，需要散热的模块必须在点火后连接散热器。为了解决与传统LTCC技术相关的许多问题，Sarnoff开发了一种改进的方法，称为低温共烧陶瓷-金属(LTCC-M)，在这种方法中，一种特殊配方的多层陶瓷结构被连接到金属载体或“芯”上。陶瓷烧成和附芯过程是在同一步骤进行的。所得到的结构在衬底的平面上几乎没有收缩。
Over the last several years, the customer-driven wireless market has pushed the developers of RF hardware towards more functionality in less volume, operation at ever higher RF frequencies, and greater circuit and functional integration. Additionally, the pressure to reduce costs has forced designers to look at less expensive manufacturing, assembly, and testing techniques. Multilayer and multichip system integration techniques have been realized in many different formats, each with its own strengths and weaknesses. Best performance is generally obtained using hybrid technology on high temperature ceramics, while lowest cost is often achieved with several of the organic (or "soft") board technologies. Low temperature cofired ceramic (LTCC) technology has the potential to deliver both high performance and low cost. In its basic version, however, it suffers from two major drawbacks. First, the ceramic shrinks after firing in all three dimensions. This limits the size of the boards that can be processed, imposes limitations on embedded passive components, and introduces complexity in the processing of boards with cavities. In addition, modules requiring heat removal must have a heat spreader attached after firing. In order to address many of the problems associated with conventional LTCC technology, Sarnoff has developed an improved approach, called low temperature cofired ceramic on metal (LTCC-M), in which a specially formulated multilayer ceramic structure is attached to a metal carrier or "core". The ceramic firing and core attachment process occur in one and the same step. The resulting structure exhibits virtually no shrinkage in the plane of the substrate.