Enhancing the Reactivity of Al/CuO Nanolaminates by Cu Incorporation at the Interfaces
Enhancing the Reactivity of Al/CuO Nanolaminates by Cu Incorporation at the Interfaces
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DOI：
10.1021/acsami.5b02653
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发表时间：
2015-06-10
影响因子：
9.5
通讯作者：
Rossi, Carole
中科院分区：
文献类型：
--
作者：
Marin, Lorena;Nanayakkara, Charith E.;Rossi, Carole
在Al和CuO层之间原位沉积薄层（约5nm）的铜层可以提高纳米层合材料的整体反应性。透射电子显微镜成像、原位红外光谱、低能离子散射测量和第一性原理计算的结合表明，铜自发地扩散到铝层中（在CuO层中基本上较少）。界面Al:Cu合金的形成与熔融温度低于纯Al金属是反应性增强的原因，为控制铝层的化学性质和提高纳米能多层体系的反应性开辟了一条途径。
In situ deposition of a thin (similar to 5 nm) layer of copper between Al and CuO layers is shown to increase the overall nanolaminate material reactivity. A combination of transmission electron microscopy imaging, in situ infrared spectroscopy, low energy ion scattering measurements, and first-principles calculations reveals that copper spontaneously diffuses into aluminum layers (substantially less in CuO layers). The formation of an interfacial Al:Cu alloy with melting temperature lower than pure Al metal is responsible for the enhanced reactivity, opening a route to controlling the stochiometry of the aluminum layer and increasing the reactivity of the nanoenergetic multilayer systems in general.