Enhanced Boron Nitride/Polyolefin Blends for High Voltage Applications
Enhanced Boron Nitride/Polyolefin Blends for High Voltage Applications
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DOI：
10.1109/tnano.2021.3120147
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发表时间：
2021-01-01
影响因子：
2.4
通讯作者：
German, Ian
中科院分区：
文献类型：
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作者：
Hosier, Ian L.;Andritsch, Thomas;German, Ian
研究了提高剥离强度对六方氮化硼（h-BN）/聚乙烯/聚丙烯复合材料电性能的影响。使用化学和热处理来获得剥离的h-BN，其最初以2 wt. %.使用扫描电子显微镜来研究颗粒分散，同时使用AC击穿强度和电导率的测量来评估介电性能。结果发现，酸/过氧化氢的方法是有效的剥离h-BN的电子显微照片中的大的微米级的聚集体的情况下所证明的。相对于未填充的主体聚合物，AC击穿强度增加20%，电导率降低5倍。然后将采用剥离的h-BN的复合材料与在宽的组成范围内采用未处理的h-BN的类似系统进行比较。虽然在未填充的主体聚合物的性能上结合未处理的h-BN有一些优势，但使用处理的h-BN允许在比迄今报道的低得多的填料负载量（类似于2%）下获得最大AC击穿强度。这允许使用小得多的h-BN负载来增强介电性能，从而降低制造成本。此外，在高填料负载下，可以有效地改善热导率。这种增强材料可以部署在高压电缆和电容器中。
The effect of improved exfoliation on the electrical properties of hexagonal boron nitride (h-BN) composites based on polyethylene and polypropylene was studied. Chemical and thermal treatments were used to obtain exfoliated h-BN which was initially added to the host polymer at 2 wt. %. Scanning electron microscopy was used to study the particle dispersion, whilst measurements of AC breakdown strength and electrical conductivity were used to assess dielectric performance. It was found that an acid/hydrogen peroxide method was effective at exfoliating h-BN as evinced by an absence of large micron-scale aggregates in electron micrographs. A 20% increase in AC breakdown strength and a factor of 5 decrease in the electrical conductivity was attained relative to the unfilled host polymer. Composites employing exfoliated h-BN were then compared to analogous systems employing untreated h-BN over a wide compositional range. Whilst there was some advantage in incorporating untreated h-BN over the properties of the unfilled host polymer, the use of treated h-BN allowed maximum AC breakdown strength to be obtained at much lower filler loadings (similar to 2%) than hitherto reported. This allows a much smaller h-BN loading to be used for enhanced dielectric properties, reducing manufacturing costs. In addition, at high filler loadings, the thermal conductivity could be usefully improved. Such enhanced materials could be deployed in high voltage cables and capacitors.