Cracking failure study of ITER-reference tungsten grade under single pulse thermal shock loads at elevated temperatures

Cracking failure study of ITER-reference tungsten grade under single pulse thermal shock loads at elevated temperatures
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DOI:
10.1016/j.jnucmat.2009.01.313
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发表时间:
2009-06-15
影响因子:
3.1
通讯作者:
Batilliot, M.
Batilliot, M.
中科院分区:
工程技术2区
文献类型:
--
作者:
Hirai, T.;Pintsuk, G.;Batilliot, M.

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在单次热冲击载荷下检查了 ITER 参考钨牌号的裂纹形成情况。通常在负载表面观察到两种裂纹:大裂纹和微裂纹。微观结构被量化并讨论了形成机制。主要裂纹是由于钨材料的脆性而产生的,微裂纹是在高温塑性变形过程中形成的。塑性变形还导致负载区域的表面升高。在更强烈的热冲击载荷条件下,微裂纹消失,并且观察到由于再结晶导致的表面改性。 (C) 2009 年,Elsevier B.V. 出版
Crack formation in an ITER-reference tungsten grade was examined under single thermal shock loading. Typically two sorts of cracks, major cracks and microcracks, were observed at the loaded surfaces. The microstructures were quantified and the formation mechanisms were discussed. The major cracks were generated due to the brittleness of the tungsten material and microcracks were formed in a process which was initiated by plastic deformation at high temperature. The plastic deformation caused also surface elevation of the loaded area. At more intense thermal shock loading conditions, the microcracks disappeared and surface modifications due to recrystallization was observed. (C) 2009 Published by Elsevier B.V.