Copper-rubber interface delamination in stretchable electronics
Copper-rubber interface delamination in stretchable electronics
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DOI:
10.1016/j.scriptamat.2010.06.041
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发表时间:
2010-10-01
影响因子:
6
通讯作者:
Geers, M. G. D.
中科院分区:
文献类型:
--
作者:
Hoefnagels, J. P. M.;Neggers, J.;Geers, M. G. D.
Interface delamination in metal-rubber-type stretchable electronic systems leads to early failure. This paper reports an investigation of metal rubber interfaces through in situ scanning electron microscopy imaging of the progressing delamination front of 90 degrees peel tests of rubber on copper samples. The results show that the energy dissipated in the forming, elongation and rupture of similar to 50 mu m long fibrils constitutes the major part of the work of separation. The experiments are characterized and modeled using a cohesive zone-enriched finite-element model. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.